Planar Magnetic Winding Layout for Lower Thermal Gradients
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Solution Overview
Problem
Conventional planar magnetic components on PCBs suffer from inefficient thermal performance due to overlapping conductive traces, leading to hot spots and premature failure, while increasing the size and mass to address this issue compromises the benefits of compact design.
Innovation Solution
The design of adjacent conductive layers with varying trace widths and non-aligned gaps between turns enhances thermal performance by improving heat transfer through dielectric layers, maintaining component size and mass.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness or width of conductive windings is increased to dissipate thermal gradients, then thermal performance is improved, but component size and mass increase
Solution Approach 1:
The patent transitions from planar 2D trace arrangements to a 3D立体 configuration by offsetting gaps between adjacent spiral layers. This dimensional change creates vertical thermal pathways through the dielectric material, enabling heat dissipation without increasing the horizontal footprint or mass of the component.
Solution Approach 2:
The dielectric material, traditionally viewed only as an electrical insulator, is repurposed as a thermal conduction pathway. By offsetting the spiral gaps between layers, the dielectric material becomes an intermediary that facilitates heat transfer from high-density winding regions to lower-density regions, improving thermal performance without adding conductive material.
2Temperature
If the thickness or width of conductive windings is increased to dissipate thermal gradients, then thermal performance is improved, but component size increases
Solution Approach 1:
The patent utilizes the vertical dimension (z-axis) by offsetting gaps between spiral layers, creating three-dimensional thermal management. This approach dissipates heat through the thickness of the PCB stack-up rather than requiring larger planar dimensions, thereby maintaining compact component area while improving thermal performance.
3Ease of manufacture
If conventional overlapping spiral traces are used, then manufacturing is simplified, but hot spots and premature failure occur
Solution Approach 1:
The patent introduces asymmetry in the gap positioning between adjacent spiral layers. Instead of symmetric overlapping gaps that create hot spots, the gaps are deliberately offset to create staggered thermal pathways. This asymmetric arrangement maintains manufacturing simplicity while eliminating the thermal concentration that leads to premature failure.
4Weight of stationary object
If minimal conductive material is used, then component size is reduced, but thermal performance deteriorates
Solution Approach 1:
The dielectric material serves as a thermal intermediary, replacing the need for additional conductive material. By offsetting spiral gaps, the dielectric enables heat transfer between layers, achieving effective thermal management with minimal conductive material while maintaining compact component mass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a significant reduction in temperature gradient between turns, effectively dissipating heat and maintaining component integrity with minimal conductive material.
Implementation Method 1
heat transfer through dielectric layers
Data Source
AI summary
A magnetic device, such as an inductor or transformer, having enhanced thermal performance characteristics includes first and second parallel adjacent conductive layers patterned to define conductive spiral traces, wherein the traces are geometrically patterned to avoid overlapping of gap areas defined between the adjacent spiral traces, and thereby provide for improved heat transfer between adjacent conductive layers in the device.