Planar Optical Fiber Traces for Attenuation Control
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Solution Overview
Problem
Existing electronic circuit boards face challenges in protecting and isolating delicate optical fiber traces from environmental contaminants and processes like wave soldering, which can cause optical attenuation during assembly.
Innovation Solution
The integration of surface-accessible, planar-shaped inter-board optical fiber traces within the circuit board, optically connected to optical interfaces such as GRIN lenses, which displace liquid contamination and provide accessible surfaces for cleaning, thereby reducing optical attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If optical fiber traces are exposed on the surface of the circuit board for easy connection, then ease of operation is improved, but reliability deteriorates due to exposure to environmental contaminants and wave soldering processes
Solution Approach 1:
The optical fiber traces are nested within the circuit board structure, with only the necessary connection portions exposed. The traces are embedded in the board substrate and protected by layers of preform material, creating a nested configuration that shields the delicate optical fibers from environmental contaminants and soldering processes while maintaining accessible connection points at the board edge.
Solution Approach 2:
A planar optical interface structure acts as an intermediary between the exposed optical fiber ends and external connectors. This interface includes flat optical surfaces that facilitate reliable coupling while isolating the embedded fiber traces from direct exposure to contaminants. The intermediary structure provides a controlled transition zone that protects the optical paths during assembly and operation.
2Reliability
If optical fiber traces are embedded within the circuit board for protection, then reliability is improved, but ease of operation deteriorates due to difficulty in accessing and cleaning the optical surfaces
Solution Approach 1:
The optical fiber traces are nested within the circuit board structure, with only the necessary connection portions exposed. The traces are embedded in the board substrate and protected by layers of preform material, creating a nested configuration that shields the delicate optical fibers from environmental contaminants and soldering processes while maintaining accessible connection points at the board edge.
Solution Approach 2:
The optical interface is designed with planar surfaces that extend to the board edge, creating a two-dimensional accessible interface from the embedded three-dimensional fiber structure. This dimensional transition allows cleaning and maintenance to be performed on the exposed planar surfaces without requiring access to the embedded portions, solving the accessibility problem while maintaining protection.
3Productivity
If liquid contamination is present on optical surfaces during assembly, then manufacturing precision deteriorates due to optical attenuation, but productivity is improved by using wave soldering processes
Solution Approach 1:
The optical fiber traces are nested within the circuit board structure, with only the necessary connection portions exposed. The traces are embedded in the board substrate and protected by layers of preform material, creating a nested configuration that shields the delicate optical fibers from environmental contaminants and soldering processes while maintaining accessible connection points at the board edge.
Solution Approach 2:
The vulnerable optical fiber traces are extracted from the surface and embedded within the board structure, removing them from the harmful wave soldering environment. Only the hardened, protected ends are exposed for connection, separating the optical paths from the soldering process entirely and eliminating liquid contamination risks during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects optical fiber traces from environmental contaminants and wave soldering processes, ensuring reliable optical connections and improved communication performance by minimizing liquid-induced attenuation.
Implementation Method 1
optical interfaces such as GRIN lenses, which displace liquid contamination and provide accessible surfaces for cleaning, thereby reducing optical attenuation
Data Source
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AI summary
Circuit boards employing optical interfaces optically connected to surface- accessible, planar-shaped inter-board optical fiber traces, and related connectors, assemblies, and methods are disclosed. The circuit boards include inter-board optical fiber traces optically connected to optical components interfacing optical signals to electronic signal components in the circuit board. Providing inter-board optical fiber traces protects the optical fiber traces from the environment. To optically interface to the inter-board optical fiber traces, planar-shaped end portions of the inter-board optical fiber traces are provided surface accessible on the circuit board. In this manner, optical interfaces can be optically connected to planar-shaped, end portions of the inter-board optical fibers traces to establish optical connections. As an example, by the end portions of inter-board optical fiber traces being planar-shaped, the end portions of the inter-board optical fiber traces can be liquid displacing during assembly to avoid or reduce optical attenuation from liquid contamination.