Planar Passivation Layers for Fragile Semiconductor Surface Features
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Solution Overview
Problem
Conventional semiconductor device fabrication and processing face challenges due to increased fragility and complexity as functional density increases, leading to higher chances of failures during handling and packaging, particularly at non-planar features where stressors concentrate.
Innovation Solution
The implementation of a planar passivation layer that is formed over non-planar structures to eliminate weak points, providing a uniform, stress-resistant surface by planarizing the overlayable surface of semiconductor devices, which can include protrusions, depressions, and transitions, thereby reducing susceptibility to stressors like compression, moisture, and shear forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If functional density is increased to achieve higher device density and lower cost, then production efficiency is improved and costs are reduced, but the semiconductor devices become more fragile and the chance of failures increases
Solution Approach 1:
A planar passivation layer is formed over non-planar structures (protrusions, depressions, transitions) before packaging and handling operations. This layer acts as a cushioning protective barrier that prevents stress concentration at vulnerable non-planar features, thereby reducing device fragility and failure chances during subsequent processing and handling while maintaining high functional density
2Device complexity
If functional density is increased to achieve higher device density, then more interconnected devices per chip area are achieved, but the distance between interconnected layers and devices decreases making devices more fragile
Solution Approach 1:
The passivation layer is selectively applied to protect specific vulnerable regions (non-planar structures such as protrusions, depressions, and transitions) rather than uniformly across the entire device surface. This localized protection approach strengthens the most fragile areas where stressors concentrate, maintaining device robustness despite increased functional density and reduced spacing between interconnected structures
3Ease of manufacture
If conventional fabrication methods are used without planar passivation, then manufacturing simplicity is maintained, but weak points at non-planar features lead to higher failure rates during handling and packaging
Solution Approach 1:
The planar passivation layer is formed as a preliminary protective measure during the fabrication process, before devices undergo handling and packaging operations. This advance protection eliminates weak points at non-planar features, significantly reducing failure rates during subsequent processing steps while adding minimal complexity to the overall manufacturing workflow
Data Source
AI summary
A semiconductor device includes: a protruding conductive structure that protrudes to a height from a first surface of the semiconductor device; and a first passivation layer, the first passivation layer overlaying the protruding conductive structure by a first thickness, the first passivation layer overlaying the first surface by a second thickness greater than the first thickness, wherein the first passivation layer is planar at a top surface over the first thickness and the second thickness.