Planar PCB Power Module Layout for Trace Loss and Heat Dissipation
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Solution Overview
Problem
Conventional power modules face challenges in achieving high power density and efficiency due to the limitations of PCB layer increases, which lead to overheating, increased costs, and trace loss, making it difficult to connect multiple isolation transformers effectively.
Innovation Solution
The power module design includes a magnetic element with a specific core structure and winding arrangement on a PCB, where the primary and secondary winding circuits are positioned on opposite sides of the magnetic element, allowing for improved thermal conductivity and reduced trace loss by optimizing the electrical path and air flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of PCB layers is increased to increase power, then the power capacity is improved, but the heat dissipation becomes difficult and the cost increases
Solution Approach 1:
The patent transitions from a conventional multi-layer PCB vertical stacking approach to a planar arrangement where the magnetic element and winding circuits are disposed on a single PCB layer. This dimensional change eliminates the heat accumulation problem of inner layers while maintaining power capacity through optimized spatial layout of the primary and secondary winding circuits on the same plane.
2Power
If the number of PCB layers is increased to increase power, then the power capacity is improved, but the trace loss increases
Solution Approach 1:
By arranging the primary and secondary winding circuits on the same PCB layer rather than stacking them vertically across multiple layers, the patent reduces the total trace length required for electrical connections. This planar configuration minimizes the number of inter-layer vias and connection paths, thereby reducing trace loss while achieving the required power capacity.
3Reliability
If the isolation transformer is positioned in the middle of the PCB, then the electrical isolation is achieved, but the air flow is blocked and overheating occurs
Solution Approach 1:
The patent positions the magnetic element (isolation transformer) at the periphery of the PCB rather than in the center, creating localized optimal conditions: the peripheral position maintains electrical isolation functionality while simultaneously providing unobstructed air flow paths across the majority of the PCB surface for effective heat dissipation. This spatial reconfiguration resolves the conflict between isolation reliability and thermal management.
4Reliability
If the connection trace length is increased to connect secondary winding to secondary winding circuit, then the electrical connection is established, but the trace loss increases
Solution Approach 1:
The patent implements a planar layout where the secondary winding circuit is disposed adjacent to the magnetic element on the same PCB layer. This configuration dramatically shortens the connection trace length between the secondary winding and the secondary winding circuit, reducing the number of vias and connection points. The electrical connection reliability is maintained through optimized trace routing while energy loss is minimized through reduced trace length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal conductivity and reduces trace loss, leading to improved power density and efficiency without increasing the number of PCB layers, thus addressing the limitations of conventional power modules.
Implementation Method 1
The magnetic element has a first side, a second side, a third side and a fourth side. The primary winding circuit is disposed on the first PCB and positioned in a vicinity of the first side or the second side of the magnetic element. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third side or the fourth side of the magnetic element.
Data Source
AI summary
A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.