Double-Sided Cooled Planar Power Module Packaging
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Solution Overview
Problem
Current power electronics systems in hybrid electric vehicles and electric vehicles face challenges in cost, reliability, functionality, power density, and efficiency due to limitations in power module packaging, particularly in thermal management and electrical interconnections.
Innovation Solution
The integration of planar power modules with double-sided heat exchangers and a segmented coolant manifold creates a sealed enclosure for efficient coolant circulation, enhancing both electrical conversion and thermal management within a compact, high-power-density assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional power module packaging is used, then manufacturing simplicity is maintained, but thermal management efficiency deteriorates
Solution Approach 1:
The coolant manifold is divided into multiple segmented sections that can be separately manufactured and then assembled together. Each segment corresponds to a specific power module, allowing for modular manufacturing while achieving comprehensive thermal management across the entire assembly.
Solution Approach 2:
The packaging structure merges multiple functions into a single integrated assembly: electrical interconnection, thermal management, and mechanical support are combined. The DBC substrates serve both electrical and thermal purposes, while the coolant manifold integrates cooling for multiple power modules simultaneously.
2Power
If power density is increased, then system efficiency improves, but thermal management difficulty increases
Solution Approach 1:
The cooling approach transitions from single-sided to double-sided cooling, utilizing both upper and lower surfaces of the power modules for heat dissipation. This dimensional expansion of the cooling interface significantly enhances thermal management capacity without increasing the footprint area.
Solution Approach 2:
The DBC (Direct Bonded Copper) substrates serve as intermediary elements that provide both electrical connection and thermal conduction pathways. These substrates act as heat sinks and thermal conduits, efficiently transferring heat from the power semiconductor devices to the coolant system.
3Reliability
If integrated thermal management is implemented, then operating temperature decreases, but manufacturing complexity increases
Solution Approach 1:
The coolant manifold is divided into multiple segmented sections that can be separately manufactured and then assembled together. Each segment corresponds to a specific power module, allowing for modular manufacturing while achieving comprehensive thermal management across the entire assembly.
Solution Approach 2:
The DBC substrates perform multiple functions simultaneously: electrical interconnection between power modules, thermal conduction to transfer heat, and mechanical support for the semiconductor devices. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces operating temperatures, increases power density, and improves manufacturability, leading to enhanced reliability and cost-effectiveness compared to conventional packaging methods.
Implementation Method 1
The two cold plates with pin fins on one side are directly bonded to one outside surfaces of the DBC substrates
Implementation Method 2
The two cold plates with pin fins on one side are directly bonded to one outside surfaces of the DBC substrates
Implementation Method 3
The segmented coolant manifold has a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet to circulate a coolant (gas or liquid) about the coolant flow path
Data Source
AI summary
An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.