Planar Radiation Alignment for High-Precision Light Emitters
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Solution Overview
Problem
The challenge lies in producing high-precision radiation arrangements with small structural size, high efficiency, and low manufacturing costs, while maintaining precise alignment of components to achieve collimatable and polarizable radiation, which is hindered by component tolerances and complex alignment processes in current methods.
Innovation Solution
A method involving a first substrate with a radiation source and a deflection element, where the radiation is deflected and aligned to pass through a predefined coupling-out region on a second substrate, allowing for precise alignment in a plane parallel to the substrate surface, thereby simplifying the alignment process and reducing the need for perpendicular alignment, and using spacers and a housing to maintain a protective atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If radiation arrangements are miniaturized to occupy extremely small space and produced in large numbers on a wafer, then productivity and compactness are improved, but manufacturing precision deteriorates due to dominant component tolerances and difficult alignment
Solution Approach 1:
The patent transitions from conventional three-dimensional alignment (requiring positioning in x, y, and z directions) to two-dimensional planar alignment only. The radiation source and optical unit are mounted on the same substrate plane, eliminating the need for perpendicular alignment. This dimensional reduction simplifies the alignment process while maintaining precision, allowing high-volume production without sacrificing manufacturing precision.
Solution Approach 2:
The patent merges the radiation source and optical unit onto a single substrate, creating an integrated planar structure. This consolidation eliminates separate mounting steps and reduces the number of alignment operations required, thereby improving both productivity through simplified manufacturing and manufacturing precision by reducing cumulative tolerances from multiple assembly steps.
2Manufacturing precision
If additional alignment perpendicular to substrate surface is performed to compensate for substrate thickness fluctuations, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent eliminates the z-direction (perpendicular to substrate) alignment by designing a planar structure where all components lie on the same plane. This removes the need for complex perpendicular alignment procedures, adhesives, or solders of varying thicknesses, thereby reducing device complexity while maintaining precision through two-dimensional alignment only.
Solution Approach 2:
The patent extracts the perpendicular alignment step from the manufacturing process by designing a structure that inherently operates in the plane of the substrate. By removing this complex alignment step, the patent simplifies the overall manufacturing process without compromising the precision of component positioning.
3Reliability
If lasers are operated in hermetically protected atmosphere to reduce wear, then reliability is improved, but device complexity increases due to additional sealing structures
Solution Approach 1:
The patent integrates the sealing function into the existing substrate structure rather than adding separate hermetic sealing components. The substrate itself is designed to provide both mechanical support and environmental protection, merging multiple functions into a single structure and reducing overall device complexity while maintaining laser reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of radiation arrangements with precise emission points, low wear, and efficient manufacturing in large volumes, minimizing material consumption and costs, while maintaining high precision and image quality.
Implementation Method 1
a first deflection element for deflecting the first electromagnetic radiation is arranged on the first substrate in a beam path of the first electromagnetic radiation such that the first electromagnetic radiation is deflected in a direction away from the first substrate
Data Source
AI summary
A method for producing a radiation arrangement includes providing a first substrate, arranging a first radiation source or generating first electromagnetic radiation thereon, arranging a first deflection element on the first substrate in a beam path of the first electromagnetic radiation such that the first electromagnetic radiation is deflected in a direction away from the first substrate, providing a second substrate, forming a first coupling-out region in the second substrate at a predefined position, determining an actual position of the first coupling-out region, detecting the deflected first electromagnetic radiation as a result of which a beam path of the deflected first electromagnetic radiation can be determined, aligning the first radiation source and the first deflection element on the first substrate depending on the determined actual position of the first coupling-out region.