Planar Relay Plate Wiring for Thin Semiconductor Modules
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Solution Overview
Problem
Existing semiconductor modules face issues with bonding wire sagging and sweep due to three-dimensional wiring structures, leading to increased module thickness and size.
Innovation Solution
A semiconductor module design featuring a base plate, relay plate, and terminal member on the same plane with gaps, connected by bonding wires, and a mold resin shaped as a rectangular sheet to inhibit wire sagging and sweep, reducing resin thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a three-dimensional wiring structure with relay wire member is used to inhibit wire sagging and wire sweep, then wire connection reliability is improved, but the height of bonding wire loop is increased, resulting in increased mold resin thickness and module size
Solution Approach 1:
The patent transitions from a three-dimensional wiring structure to a planar (two-dimensional) wiring structure by arranging the relay wire member on the same plane as the base plate. This dimensional reduction eliminates the need for vertical wire loops, thereby reducing mold resin thickness while maintaining wire connection reliability through optimized planar wire routing and tension control.
Solution Approach 2:
The wiring structure is segmented into distinct functional zones: the base plate with electrode pads, the relay wire member extending horizontally, and the bonding wires connecting to semiconductor elements. This segmentation allows each component to be optimized independently, with the relay wire member serving as an intermediate connection point that reduces overall wire length and loop height.
2Manufacturing precision
If bonding wire length is reduced to prevent wire sagging and wire sweep, then manufacturing precision is improved, but device complexity increases due to additional relay wire member and multi-point wire bonding
Solution Approach 1:
The relay wire member serves multiple functions simultaneously: it acts as an electrical connection path, a mechanical support structure for bonding wires, and a space-saving element that reduces wire loop height. This multi-functionality reduces overall device complexity despite the addition of the relay wire member, as it consolidates several roles into a single component.
Solution Approach 2:
The relay wire member functions as an intermediary element between the base plate electrode pads and the semiconductor element electrode pads. This intermediary structure enables shorter, more precise bonding wires while maintaining electrical connectivity, thereby improving manufacturing precision without significantly increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively inhibits bonding wire sagging and sweep, allowing for a reduction in mold resin thickness and module size while maintaining heat dissipation properties and improving productivity.
Implementation Method 1
The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire
Implementation Method 2
a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, the first bonding wire and the second bonding wire
Data Source
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AI summary
The present disclosure includes: a base plate (50) having a shape of a sheet; a relay plate (60) having a shape of a sheet; a terminal member (80); and an electronic component joined to one surface of the base plate (50). The base plate (50), the relay plate (60), and the terminal member (80) are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate (60) are connected to each other by a bonding wire (46). The one surface of the relay plate (60) and one surface of the terminal member (80) are connected to each other by a bonding wire (46).