Planar Spring Microprobes for Precision Wafer Testing
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Solution Overview
Problem
Existing microprobe technologies face challenges in achieving improved mechanical and electrical properties, reduced fabrication costs, and increased versatility in design, particularly in the production of miniature devices with complex geometries and enhanced compliance for electronic circuit connections.
Innovation Solution
The development of microprobes with compliant elements formed from multiple non-linear planar springs, which are stacked serially to provide compliance along the longitudinal axis, and can be used as individual probes with single or dual contact tips, or with reversed orientations for enhanced contact surfaces, integrated with multi-layer, multi-material electrochemical fabrication methods for precise structure formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional microprobe fabrication methods are used, then manufacturing precision can be achieved, but device complexity increases and fabrication time increases
Solution Approach 1:
The patent replaces traditional mechanical fabrication methods (such as mechanical drilling, punching, or assembling of probe components) with electrochemical fabrication processes. This substitution enables precise formation of microprobe structures, spring elements, and contact surfaces through controlled electrochemical reactions, thereby achieving high manufacturing precision while reducing mechanical process complexity
Solution Approach 2:
The patent utilizes parameter changes in electrochemical processes (such as varying current density, electrolyte composition, temperature, and reaction time) to precisely control the formation of microprobe structures, spring element geometry, and material properties. By adjusting these parameters, the fabrication process achieves high precision without requiring complex mechanical intervention
2Manufacturing precision
If traditional microprobe fabrication methods are used, then manufacturing precision can be achieved, but fabrication time increases
Solution Approach 1:
The patent replaces time-consuming mechanical fabrication steps with parallel electrochemical processes that can simultaneously form multiple microprobe structures, spring elements, and contact surfaces. This substitution dramatically reduces fabrication time while maintaining or improving precision through controlled electrochemical reactions
Solution Approach 2:
The patent employs preliminary electrochemical treatment steps (such as pre-plating, pre-etching, or surface activation) that prepare substrates for subsequent fabrication steps. These preliminary actions enable faster and more precise formation of final microprobe structures by creating optimal surface conditions beforehand, thereby reducing overall fabrication time
3Reliability
If compliant elements are added to improve mechanical properties, then reliability increases, but device complexity increases
Solution Approach 1:
The patent applies local quality by incorporating compliant spring elements only at specific locations where contact flexibility is needed, rather than making the entire microprobe structure complex. The spring elements are strategically positioned at contact points or support structures, providing localized compliance while keeping the overall device design simple and the body rigid for structural integrity
Solution Approach 2:
The patent merges the spring element functionality with the structural body by integrating the compliant elements as integral parts of the microprobe assembly. The spring elements are electrochemically formed as unified structures with the probe body, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in microprobes with improved mechanical and electrical properties, reduced fabrication times and costs, and increased design versatility, enabling more effective and efficient electrical connections in electronic circuits.
Implementation Method 1
Embodiments of the invention are directed to microprobes (e.g. for use in the wafer level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components) and more particularly to pin-like microprobes
Implementation Method 2
multi-layer, multi-material electrochemical fabrication methods
Implementation Method 3
spring elements have planar configurations when in an unbiased state... compliant elements formed from multiple non-linear planar springs... provide compliance along the longitudinal axis
Data Source
AI summary
Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.