Planar Surge Suppression Circuit Layout for Thin Heat-Dissipating Modules

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Solution Overview

Problem

Existing surge suppression devices with multiple series circuits are bulky and lack a detailed structure for reduction in thickness, particularly for mounting on devices that generate surge voltages.

Innovation Solution

A surge suppression device design featuring resistors and capacitors arranged in series circuits, embedded in an embedding resin, with a placement member aligning resistors in parallel, and capacitors mounted on a substrate, all aligned in a plane parallel to the resistor's longitudinal direction, reducing thickness and improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple series circuits are used for surge suppression, then surge suppression capability is improved, but device thickness increases

Engineering Contradiction:
Improvesurge suppression capabilityVSAvoiddevice thickness
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent transitions from a vertical stacking arrangement to a planar arrangement where multiple series circuits are laid out side-by-side in parallel. The resistors are arranged horizontally with their long sides parallel to each other, and capacitors are positioned adjacent to corresponding resistors, all within the same plane. This dimensional change from vertical to lateral arrangement reduces device thickness while maintaining multiple circuit functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent integrates multiple series circuits into a single planar structure where resistors and capacitors are arranged in close proximity within the same plane. The embedding resin combines multiple circuit elements into a unified structure, merging what would traditionally be separate vertical components into a consolidated planar arrangement, thereby reducing overall device thickness.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If multiple series circuits are arranged vertically, then circuit functionality is achieved, but heat dissipation is insufficient

Engineering Contradiction:
Improvecircuit functionalityVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent arranges heat-generating resistor elements horizontally in parallel rather than vertically stacking them. This lateral arrangement increases the surface area exposed to ambient air and embedding resin for heat dissipation. The resistors are positioned with their long sides parallel, creating extended heat dissipation surfaces that improve thermal management while maintaining circuit functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If components are densely packed, then device size is reduced, but electrical insulation is compromised

Engineering Contradiction:
Improvedevice sizeVSAvoidelectrical insulation
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent uses embedding resin as an intermediary material that fills the spaces between closely positioned resistors and capacitors. This resin provides electrical insulation while allowing the components to be arranged in a compact planar configuration. The embedding resin acts as a mediator that enables dense packing without compromising insulation, as it fills gaps and provides dielectric separation between conductive elements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a thinner surge suppression device with enhanced heat dissipation and improved electrical insulation, while suppressing surge voltage applications to motors.

Implementation Method 1

an embedding resin that embeds a plurality of the resistors constituting the plurality of series circuits

Methodology Applied
Scientific EffectEmbedding:

Implementation Method 2

improving heat dissipation

Methodology Applied
Scientific EffectHeat dissipation:

Data Source

PatentUS12500409B2Surge suppression device
Publication Date: 2025.12.16 PROTERIAL LTD
  • US12500409B2 patent drawing
  • US12500409B2 patent drawing
  • US12500409B2 patent drawing

AI summary

A surge suppression device is provided with a plurality of series circuits each of which includes a resistor and a capacitor that are connected in series, an embedding resin that embeds a plurality of the resistors constituting the plurality of series circuits, and a placement member that places a plurality of the capacitors constituting the plurality of series circuits. The plurality of resistors are arranged in parallel, and the embedding resin and the placement member are aligned in a direction of a plane parallel to both a resistor longitudinal direction which is a longitudinal direction of the resistor and a resistor alignment direction in which the plurality of resistors are aligned.