Planar Transducer Layer Structure for Galvanic Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional intrinsically safe transducers are bulky due to the requirement for multiple insulation layers, leading to increased thickness and complexity, which is a challenge for miniaturization and integration into compact devices.
Innovation Solution
A planar intrinsically safe transducer design with a layer structure where the magnetic core encompasses the circuits, relocating insulation thickness from the vertical to the horizontal dimension, allowing for reduced overall thickness and optimized geometry, while maintaining galvanic isolation and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insulation layers are used to ensure galvanic isolation and meet safety distances, then safety and insulation performance are improved, but the overall thickness and device complexity increase
Solution Approach 1:
The patent relocates insulation from the vertical dimension to the horizontal dimension by arranging circuits on the same planar layer with sufficient horizontal separation. This allows galvanic isolation to be achieved through lateral spacing rather than stacking multiple insulation layers vertically, thereby reducing overall thickness while maintaining safety distances.
Solution Approach 2:
The magnetic core encompasses multiple circuits within a single vertical space, allowing circuits that would traditionally require separate insulation layers to instead share the same vertical envelope. The core provides magnetic coupling while the horizontal spacing between circuits provides the required galvanic isolation, merging multiple functions into a compact structure.
2Reliability
If multiple insulation layers are used to ensure galvanic isolation, then safety distances are ensured, but the device complexity and manufacturing complexity increase
Solution Approach 1:
By transitioning from a vertical stacking approach with multiple insulation layers to a planar approach with horizontal spacing, the patent simplifies the layer structure. Circuits are arranged on the same or fewer layers with sufficient lateral separation, reducing the number of insulation layers required and simplifying manufacturing processes.
3Reliability
If circuits are arranged on different ring cores with additional windings for magnetic coupling, then galvanic isolation is achieved, but the device volume and complexity increase
Solution Approach 1:
The patent merges multiple circuits and their associated magnetic cores into a single encompassing magnetic core structure. This allows circuits to be magnetically coupled through a shared core while maintaining galvanic isolation through horizontal spacing, significantly reducing the overall device volume compared to separate ring core assemblies.
Solution Approach 2:
Multiple circuits are nested within a single magnetic core structure, with each circuit horizontally spaced from the others. This nesting approach allows multiple isolated circuits to share a common magnetic path and vertical envelope, reducing the volume required for each individual circuit assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a significant reduction in overall thickness, enabling integration into narrow housings and reducing installation height without compromising safety distances or functionality, while minimizing space requirements and manufacturing costs.
Implementation Method 1
The fundamental physical principle of energy or data transmission is based on induction
Data Source
AI summary
A planar intrinsically safe transducer having a vertical extension and a horizontal extension having a layer structure with a plurality of circuits, wherein a first circuit and a second circuit are galvanically isolated from one another. Further, the transducer has a magnetic core 4, which at least partially encompasses the layer structure and acts at least on the first circuit and on the second circuit, wherein the first circuit and the second circuit lie in one plane and form a layer of the layer structure.