Planar Transformer Ceramic Substrate Voltage Isolation
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Solution Overview
Problem
High-density DC-to-DC power converters face limitations due to FR4 printed circuit boards' limited voltage isolation and thermal dissipation, leading to reduced performance and increased costs due to separate subsystems.
Innovation Solution
The integration of a planar transformer with input and output stages directly bonded to ceramic layers for improved voltage isolation and heat dissipation, featuring interleaved windings and ceramic insulating layers for enhanced thermal management and electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If FR4 printed circuit boards are used for power converters, then manufacturing is easier and cost is reduced, but voltage isolation and thermal dissipation are limited
Solution Approach 1:
The patent uses ceramic layers as insulating substrates instead of conventional FR4 PCBs. The ceramic material provides superior voltage isolation properties and thermal dissipation capability. The planar transformer windings are directly formed on these ceramic layers, creating an integrated structure that combines the benefits of high-reliability insulation with manufacturability through direct formation techniques.
2Temperature
If FR4 printed circuit boards are used for power converters, then manufacturing is easier and cost is reduced, but thermal dissipation is limited
Solution Approach 1:
Ceramic layers are employed as the insulating substrate material, which possesses superior thermal conductivity compared to FR4 PCBs. This allows for effective heat dissipation from the power converter components. The ceramic material is directly formed with the planar transformer windings, maintaining ease of manufacture through direct formation processes while achieving improved thermal management.
3Reliability
If separate subsystems are used for power converters, then voltage isolation and thermal dissipation are improved, but device complexity and cost increase
Solution Approach 1:
The patent integrates the planar transformer windings directly onto the ceramic insulating layers, merging the transformer structure with the insulating substrate. This integration eliminates the need for separate subsystems while maintaining the voltage isolation and thermal dissipation benefits of ceramic materials. The direct formation process creates a unified structure that reduces device complexity and manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved voltage isolation and heat dissipation, facilitating high-density power applications with increased integration and reduced manufacturing costs.
Implementation Method 1
The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage
Implementation Method 2
input and output stages that use direct bond copper to couple to ceramic layers for heat dissipation
Implementation Method 3
input and output stages that use direct bond copper to couple to ceramic layers for heat dissipation and voltage isolation
Data Source
AI summary
A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.