Planar Transformer Power Module Layout for Heat and Power Density
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Solution Overview
Problem
Existing power modules face challenges in achieving high-power density, high-efficiency, and effective heat dissipation in space-constrained environments, particularly in high-power applications where large currents exacerbate thermal performance issues.
Innovation Solution
The power module design incorporates a printed circuit board (PCB) with a transformer module featuring a magnetic core and windings formed on multiple layers of the PCB, along with a power converter circuit where power switches are distributed on both surfaces of the PCB. This configuration includes a planar transformer module with a magnetic core and windings wound around leg parts, optimizing current distribution and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power module uses traditional magnetic components and circuit layouts, then the module can handle high power, but the size becomes large and thermal performance deteriorates
Solution Approach 1:
The patent transitions from traditional planar circuit layouts to a three-dimensional stacked architecture where primary and secondary windings are positioned on opposite sides of the PCB. This vertical stacking enables higher power density by utilizing the Z-dimension, allowing multiple functional layers to coexist in a compact footprint while maintaining high power handling capability
Solution Approach 2:
The magnetic core is embedded within the PCB structure, with windings nested around the core legs that pass through multiple PCB layers. This nesting approach integrates the magnetic component directly into the circuit board, eliminating the need for separate discrete magnetic components and reducing overall module volume
2Power
If high power is processed through the module, then power density increases, but thermal performance and heat dissipation become problematic
Solution Approach 1:
The patent implements localized thermal management by positioning power switches, driver ICs, and passive devices in specific areas optimized for heat dissipation. The stacked PCB architecture allows thermal vias and heat sinks to be strategically placed beneath high-power components, creating localized heat pathways that prevent thermal accumulation while maintaining high power density
Solution Approach 2:
The PCB serves as a thermal intermediary, conducting heat away from power components through its ground planes and thermal vias. The magnetic core also acts as a thermal pathway, conducting heat from the windings to the PCB and heat sink, facilitating efficient heat transfer from high-power areas to dissipation structures
3Productivity
If more components are integrated into the module, then functionality and efficiency improve, but the complexity of the module increases
Solution Approach 1:
The PCB performs multiple functions simultaneously: it provides electrical interconnections between components, serves as a magnetic core support structure, acts as a thermal conduction pathway, and functions as a mechanical substrate. This multi-functionality reduces the need for separate dedicated components, integrating multiple functions into unified structures and reducing overall module complexity
Solution Approach 2:
The patent merges the magnetic core, windings, and PCB into a single integrated transformer assembly. Power switches and driver ICs are co-located on the same PCB, combining switching and control functions in one package. This merging of previously separate components into integrated assemblies simplifies the overall module architecture while maintaining full functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved power density, efficiency, and heat dissipation, effectively addressing the thermal challenges in high-power applications while reducing the overall size of the power module.
Implementation Method 1
The transformer module includes a magnetic core, and a primary winding and a secondary winding wound around the magnetic core
Data Source
AI summary
A power module includes a PCB, a transformer module, and a power converter circuit. The PCB has a top surface and a bottom surface. The transformer module includes a magnetic core, and a primary winding and a secondary winding wound around the magnetic core. The magnetic core has a first core unit arranged on the top surface of the PCB and a second core unit arranged on the bottom surface of the PCB. The primary winding is formed by traces on multiple layers of the PCB, the secondary winding is formed by traces on multiple layers of the PCB, the multiple layers are stacked vertically to form a winding stack. The power converter circuit has power switches, wherein a part of the power switches are disposed on the top surface of the PCB, and another part of the power switches are disposed on the bottom surface of the PCB.