Planar Vaporizer Bonding for Low-Resistance E-Cigarette Heating

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Solution Overview

Problem

Conventional electronic cigarette vaporizer devices using wick-coil technology face issues such as local overheating due to lack of liquid supply, leading to 'dry puff' and leakage, and have high-resistance electrical connections that are not thermally stable.

Innovation Solution

The method involves applying an electrically conductive adhesive between the evaporator and the carrier, followed by a high-temperature baking step to form a eutectic connection, which provides both mechanical and electrical stability and reduces contact resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional wick-coil technology is used, then the vaporizer can transport liquid through capillary forces, but it leads to localized overheating and dry puff phenomenon

Engineering Contradiction:
Improveliquid supply reliabilityVSAvoidlocalized overheating and dry puff
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes the coil structure from the vaporizer system and replaces it with a planar evaporator chip. This extraction of the problematic coil component eliminates the localized overheating issue while maintaining liquid transport through capillary forces in the wick structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the heating element from a three-dimensional coil to a two-dimensional planar evaporator chip. This parameter change in the heating structure distributes heat more evenly across the evaporator surface, preventing localized overheating while maintaining effective vaporization.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If generic evaporators are used without proper electrical connection, then the evaporator can be integrated into the device, but the electrical connection has high resistance and poor thermal stability

Engineering Contradiction:
Improveevaporator integrationVSAvoidelectrical connection stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent combines the electrical connection function with the mechanical mounting function by integrating the electrical contact into the carrier structure. The carrier both holds the evaporator chip in place and provides the electrical connection to the heating element, eliminating separate connection components and improving reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention uses a composite structure where the carrier integrates both mechanical support and electrical conduction properties. This composite approach ensures both thermal stability and low electrical resistance in the connection between the evaporator and power source.

Inventive Principle:
Principle #40Composite materials

3Device complexity

If the evaporator is mechanically mounted without eutectic bonding, then assembly is simpler, but the connection has higher electrical resistance

Engineering Contradiction:
Improveassembly processVSAvoidelectrical resistance
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent utilizes the eutectic phase transition of the solder material to create a low-resistance electrical connection. The controlled heating process melts the eutectic solder, allowing it to flow and form optimal electrical contacts between the evaporator and carrier, then solidifies to create a stable mechanical and electrical bond.

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution creates a low-resistance, high-temperature stable electrical connection that minimizes mechanical stresses and prevents 'dry puff' issues, ensuring reliable operation and extended device lifespan.

Implementation Method 1

an additional annealing step is performed in order to create a eutectic connection between the evaporator and the adhesive

Methodology Applied
Scientific EffectEutectic bonding: Fusible Alloy

Implementation Method 2

The additional annealing step is carried out at a temperature of at least 400°C, preferably at least 550°C, more preferably at least 700°C

Methodology Applied
Scientific EffectAnnealing: Annealing

Implementation Method 3

Capillary forces transport the liquid from the reservoir along a wick until it is heated by an electrically heated coil

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

The evaporator can be electrically connected to an energy storage device via the electrical line to supply electrical energy

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 5

The evaporator evaporates the liquid, and the evaporated liquid can be added to an air stream as vapor and/or aerosol

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentEP3955760B1Method for producing a vaporizing device, vaporizing device and inhaler, preferably an electronic cigarette product
Publication Date: 2024.08.28 KORBER TECHNOLOGIES GMBH
  • EP3955760B1 patent drawingFigure 1~2
  • EP3955760B1 patent drawingFigure 3~5
  • EP3955760B1 patent drawingFigure 6~7

AI summary

The invention relates to a method for producing a vaporizing device (1) for an inhaler (10), preferably for an electronic cigarette product, comprising at least one electrical vaporizer (60), at least one electrical line (105a, 105b) for supplying the vaporizer (60) with electrical current, and a support (4) for supporting the vaporizer (60). Said method comprises: applying an electrically conductive adhesive (2) between the vaporizer (60) and the support (4), in order to establish an electrical connection between the vaporizer (60) and the electrical line (105a, 105b), wherein an additional heating step is carried out in order to provide a eutectic bond between the vaporizer (60) and the adhesive (2).