Planar Voice Coil Structure for Loudspeaker Miniaturization
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Solution Overview
Problem
Conventional voice coil structures are too large for miniaturized loudspeakers, limiting their application in compact electronic devices.
Innovation Solution
A voice coil structure comprising a substrate with a first wiring layer having a winding structure and a first insulation layer, where the wiring layer is disposed on the substrate and the insulation layer defines a through hole and a notch to expose the ends for connection, allowing for a thinner, two-dimensional planar design that reduces the voice coil's thickness and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional voice coil structure is used, then the loudspeaker can produce sound, but the voice coil has a large size that cannot be used in miniaturized loudspeakers
Solution Approach 1:
The patent transitions the voice coil from a traditional three-dimensional cylindrical structure to a two-dimensional planar winding structure. The first wiring layer is formed on the substrate in a planar configuration with winding patterns, eliminating the need for vertical stacking and reducing the overall thickness and volume of the voice coil assembly while maintaining its electromagnetic functionality for sound production
Solution Approach 2:
The patent extracts and eliminates unnecessary three-dimensional structural elements from the conventional voice coil. By using a planar wiring layer directly on the substrate without requiring a cylindrical form factor or additional support structures, the design removes excess volume while preserving the essential voice coil function of converting electrical signals to mechanical vibration for sound production
2Volume of moving object
If the voice coil thickness is reduced for miniaturization, then the loudspeaker size is reduced, but the soldering efficiency and stability may be compromised
Solution Approach 1:
The patent incorporates notches in the insulation layer during the manufacturing process, which preliminarily prepare the structure for subsequent soldering operations. These notches expose portions of the wiring layer ends, creating pre-formed connection points that facilitate efficient soldering without requiring additional processing steps or increasing the overall thickness of the voice coil
Solution Approach 2:
The patent applies different structural characteristics to different regions of the voice coil. The insulation layer has notches at specific locations where soldering is needed, while the rest of the structure maintains a thin planar profile. This localized modification allows efficient soldering at connection points without compromising the overall miniaturization and thickness reduction of the voice coil
3Volume of moving object
If a planar winding structure is used, then the voice coil thickness is reduced, but the wiring layer needs proper exposure for electrical connection
Solution Approach 1:
The patent segments the insulation layer by creating notches that divide it into regions with different functions. These notches expose specific portions of the wiring layer ends while leaving other areas covered, allowing electrical connections to be made at designated points without requiring the entire wiring layer to be exposed or increasing the overall structure complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the miniaturization of loudspeakers by reducing the voice coil's thickness and size, improving soldering efficiency, and enhancing the stability of the voice coil on the diaphragm, while maintaining impedance requirements and facilitating the production of sound.
Implementation Method 1
The magnetic system produces a magnetic field. When the magnitude or direction of an external current applied to the voice coil changes, the voice coil may vibrate, thereby allowing the loudspeaker to produce sound.
Data Source
AI summary
The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.