Planar Waveguide High Frequency Module for Compact Packaging
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Solution Overview
Problem
Conventional high frequency modules with end-fire type antennas require large packaging, limiting their downsizing and compactness, especially in millimetric-wave sensing systems that need broad frequency coverage.
Innovation Solution
A high frequency module design featuring two metal plates, a dielectric substrate, and a planar waveguide with a through hole and microstrip waveguide configuration, allowing efficient conversion of high frequency waves over a wide frequency range while maintaining compactness, using a slot, co-planar, or tri-plate waveguide structure, and optimizing the position and shape of the waveguide for maximum amplitude capture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If an end-fire type antenna is used for high frequency wave conversion, then the conversion function is achieved, but the package size becomes large due to the great dimension in the depth direction
Solution Approach 1:
The patent transitions from a conventional end-fire antenna with large depth dimension to a planar antenna structure that operates in a different dimensional configuration. The planar antenna is formed on a substrate with the waveguide extending in the plane, eliminating the need for deep waveguide structures and achieving compactness in the depth direction while maintaining high frequency wave conversion functionality.
Solution Approach 2:
The patent extracts and eliminates the waveguide-microstrip conversion system that is conventionally required for waveguide antennas. By using a planar antenna directly formed on the substrate, the complex conversion components are removed, simplifying the overall structure and reducing the package size.
2Device complexity
If a waveguide-microstrip conversion system is used with waveguide antenna, then high frequency wave conversion is achieved, but the device complexity increases
Solution Approach 1:
The patent merges the antenna and circuit components into a single planar structure formed on the same substrate. The planar antenna is directly integrated with the microstrip circuit, eliminating the need for separate waveguide-microstrip conversion systems and reducing overall device complexity while maintaining reliable high frequency wave conversion.
Solution Approach 2:
The planar antenna structure serves multiple functions: it acts as both the high frequency wave receiving element and the conversion element to microstrip format. This multi-functional design eliminates the need for separate conversion components, simplifying the device structure while ensuring reliable operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves efficient and broad frequency band conversion with improved compactness, enhanced conversion efficiency, and increased frequency range, enabling smaller packaging and improved directivity for high frequency applications.
Implementation Method 1
High frequency wave in the free space captured by the through hole of the high frequency module permeates through the dielectric substrate to the metal plate on the other side of the through hole
Implementation Method 2
The high frequency wave reflected on the metal plate creates a standing wave
Implementation Method 3
The planar waveguide is so positioned that an end of the waveguide catches a maximum amplitude of the high frequency wave
Data Source
AI summary
A high frequency module for converting a high frequency wave in a free space to a high frequency wave in a planar waveguide includes two metal plates, a dielectric substrate and a planar waveguide disposed on the dielectric substrate. The dielectric substrate between the two metal plates has the planar waveguide disposed thereon, and the planar waveguide protrudes either in a through hole bored in one of the two metal plates, or in a hollow space defined by the other of the two metal plates on the dielectric substrate.