Planarization Apparatus Shared Chuck Conveyance
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Solution Overview
Problem
Current planarization methods for semiconductor devices face challenges in achieving sufficient surface planarization performance, especially with increasing depth of focus requirements in EUV lithography, and existing cluster configurations for planarization apparatuses are complex and inefficient, leading to reduced productivity due to design restrictions and conveyance issues.
Innovation Solution
A planarization apparatus with multiple processors and a shared conveyance path that uses a supplier to supply UV-curable composition to substrates, allowing for parallel processing and reducing complexity by eliminating the need for a conveyance robot, with a conveyer system that conveys substrate chucks along a common path and includes a supplier positioned along this path for efficient composition distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional spin coater is used to apply SOC film, then the film can be applied to the wafer, but the surface planarization performance is insufficient for EUV lithography depth of focus requirements
Solution Approach 1:
The planarization process is segmented into multiple processors (coating processor, curing processor, peeling processor) that operate in parallel. Each processor handles a specific step of the planarization sequence, allowing simultaneous processing of multiple wafers and achieving both high precision and productivity.
Solution Approach 2:
Multiple processors are merged into a single cluster system with a shared conveyance path. The processors work cooperatively to perform the complete planarization sequence (coating, curing, peeling) in an integrated manner, enabling parallel processing while maintaining precision requirements.
2Productivity
If a cluster configuration with multiple planarization processors and one shared dispenser system is implemented, then productivity increases, but system complexity and design restrictions increase due to separate wafer stage modules and conveyance robots
Solution Approach 1:
The substrate chuck is designed with multi-functionality, serving both as a holding device and a conveyance vehicle. The chuck can be directly conveyed along the common path between processors without requiring separate wafer stage modules or conveyance robots, reducing system complexity while maintaining productivity.
Solution Approach 2:
The conveyance robot function is extracted and eliminated from the system. Instead of using a robot to transfer wafers between modules, the substrate chuck itself is conveyed along a common path, simplifying the system architecture and reducing design restrictions.
3Manufacturing precision
If the allowable depth of focus range is decreased with increasing NA in EUV lithography, then resolution improves, but the tolerance for surface irregularities decreases
Solution Approach 1:
The planarization process is performed as a preliminary step before EUV lithography. By completing the planarization sequence (coating SOC film, curing it, and peeling the mold) in advance, the substrate surface is prepared with high precision flatness, ensuring that subsequent lithography operates within the reduced depth of focus range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances productivity and simplifies the apparatus design by enabling efficient parallel processing of substrates while minimizing complexity, improving throughput and reducing volatilization of the UV-curable composition.
Implementation Method 1
a UV light source, and a mold separation unit. The planarization processor includes a coating unit that supplies a UV-curable composition onto a substrate, a UV light source that irradiates the supplied UV-curable composition to cure it, and a mold separation unit that separates a mold from the cured UV-curable composition
Data Source
AI summary
A planarization apparatus includes a plurality of processors each configured to perform a planarization process on a substrate. Each of the processors includes a substrate chuck, and is configured to perform a planarization process on a substrate chucked by the substrate chuck. A conveyer is configured to convey a substrate chuck of a processor selected from the plurality of processors along a conveyance path including a common conveyance path shared by the plurality of processors. A supplier is arranged on a path of movement of the substrate chuck by the conveyer along the common conveyance path, and is configured to supply a composition to be used in the planarization process onto the substrate chucked by the substrate chuck.