Planarization Member Positioning Around Substrate Tolerance Regions

Solution Overview

Problem

Existing planarization technologies using imprinting technology face issues with defects on the planarization member being transferred to the substrate, leading to defective chips due to the changing relative positional relationship between the planarization member and the substrate during repeated processes.

Innovation Solution

A planarization apparatus with a drive unit and control unit that moves and controls the relative position of the planarization member and substrate based on defect information on the planarization member and substrate tolerance regions, ensuring defects are positioned away from critical areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the relative positional relationship between the planarization member and substrate is changed each time the planarization process is performed a predetermined number of times, then the defects on the planarization member do not grow, but the defects may be transferred to a position on the substrate causing defective chips

Engineering Contradiction:

Improveplanarization member defect growth preventionVSAvoiddefect transfer to substrate

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary detection of defect positions on the planarization member before the planarization process. Based on this advance information, the control unit pre-calculates and sets the optimal relative positional relationship between the planarization member and substrate, ensuring defects are positioned in tolerance regions before the actual planarization occurs.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses detected defect position information as feedback to dynamically adjust the relative positional relationship between the planarization member and substrate. The control unit continuously monitors and modifies the positioning based on the location of defects, creating a closed-loop control system that prevents both defect growth and defect transfer.

Inventive Principle:

Principle #23Feedback

2Manufacturing precision

If a planarization member with a flat surface is used for planarization, then planarization accuracy is improved, but defects on the planarization member are transferred to the substrate

Engineering Contradiction:

Improveplanarization accuracyVSAvoiddefect transfer to substrate

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The system maintains the flat surface of the planarization member for overall planarization accuracy while applying local quality control by positioning specific defect areas away from critical substrate regions. The control unit calculates optimal positioning that preserves the flat surface benefit while isolating defect locations to tolerance regions where they do not affect chip quality.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If the planarization member is in contact with the planarization material on the substrate, then planarization is achieved, but defects on the planarization member occur and grow with repeated processes

Engineering Contradiction:

Improveplanarization effectVSAvoidplanarization member defect growth

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The system performs preliminary detection of defect positions on the planarization member before the planarization process. Based on this advance information, the control unit pre-calculates and sets the optimal relative positional relationship between the planarization member and substrate, ensuring defects are positioned in tolerance regions before the actual planarization occurs.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses detected defect position information as feedback to dynamically adjust the relative positional relationship between the planarization member and substrate. The control unit continuously monitors and modifies the positioning based on the location of defects, creating a closed-loop control system that prevents both defect growth and defect transfer.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS20250357139A1Planarization apparatus, planarization method, and article manufacturing method

Publication Date: 2025.11.20 CANON KK

AI summary

A planarization apparatus configured to form a planarization layer on a substrate by bringing a planarization member into contact with a planarization material on the substrate includes a drive unit configured to move the planarization member and the substrate relative to each other, and a control unit configured to control the drive unit. The control unit controls a position of the planarization member relative to the substrate based on information about a defect on the planarization member and information about a tolerance region of the substrate where a defect is tolerated.