Planarization Film Process to Correct Curing Shrinkage Unevenness
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Solution Overview
Problem
Existing planarization techniques using curable compositions result in surface height differences due to varying shrinkage amounts based on thickness, leading to inaccuracies in planarization.
Innovation Solution
A planarization system comprising a first planarization apparatus for forming a planarization film by contacting a superstrate with droplets of a curable composition, a second planarization apparatus for forming a liquid film via spin coating, and a heat treatment apparatus for curing the liquid film, along with a method involving forming and curing liquid films without direct contact with a solid member to prevent surface conformity and enhance planarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If curable composition is arranged thick on low regions and thin on high regions to conform to substrate surface, then the curable composition can fully cover the substrate surface, but the shrinkage amount varies with thickness causing height differences on the cured surface
Solution Approach 1:
The planarization process is divided into two separate steps: first forming a planarization film using curable composition with superstrate contact, then forming an additional planarization film using liquid material without superstrate contact. This segmentation allows each step to address different aspects of planarization, with the second step specifically targeting the removal of height differences caused by shrinkage in the first step.
Solution Approach 2:
The superstrate is removed from the second planarization process, extracting the harmful influence of superstrate surface unevenness and preventing it from transferring to the final planarization film surface. This allows the liquid material to form a film that is not constrained by superstrate geometry.
2Shape
If superstrate is brought into contact with curable composition to form planarization film, then the film conforms to the lower surface of the superstrate, but surface unevenness of the superstrate is transferred to the planarization film
Solution Approach 1:
The superstrate is extracted or removed from the second planarization process, eliminating the source of surface unevenness transfer. The liquid material is applied and cured without contact with the superstrate, ensuring that superstrate surface characteristics do not influence the final film surface quality.
Solution Approach 2:
The planarization process is segmented into two independent steps: the first step uses superstrate contact for initial planarization, while the second step uses no superstrate contact for final surface refinement. This segmentation allows the second step to correct defects introduced by the superstrate in the first step.
3Strength
If curable composition is cured, then the composition hardens to form a planarization film, but shrinkage occurs causing height differences on the surface
Solution Approach 1:
The curing process is divided into two separate curing steps with different materials and conditions. The first curing forms the planarization film with structural support, while the second curing of the liquid material provides final surface flatness without significant shrinkage, as the liquid material layer is thin and applied after the first planarization.
Solution Approach 2:
The first planarization film is formed in advance to provide a stable base and reduce the thickness of the subsequent liquid material layer. This preliminary action ensures that the liquid material shrinks less during curing, minimizing height differences while still achieving the desired surface flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system and method significantly improve planarization accuracy by minimizing surface unevenness to several nanometers, reducing defects like voids, and enabling higher planarity of the resulting film surfaces.
Implementation Method 1
a heat treatment apparatus configured to perform a heat treatment for curing the liquid film formed by the second planarization apparatus
Implementation Method 2
a second planarization apparatus configured to form a liquid film by a spin coating method
Implementation Method 3
the curable composition is molded using a member called a superstrate and then cured, thereby forming a planarization film
Data Source
AI summary
A planarization system includes a first planarization apparatus configured to form a planarization film by bringing a superstrate into contact with a plurality of droplets of a curable composition arranged on a substrate, a second planarization apparatus configured to form a liquid film by a spin coating method, and a heat treatment apparatus configured to perform a heat treatment for curing the liquid film formed by the second planarization apparatus.