Planarization Force Control for Real-Time Superstrate Leveling
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Solution Overview
Problem
Current planarization techniques in semiconductor fabrication face challenges in achieving precise real-time leveling control between a superstrate and a substrate, which affects the uniformity and quality of the planarization process, particularly in addressing substrate topography and improving lithographic processes like ArF laser-based lithography, EUV lithography, and nanoimprint lithography.
Innovation Solution
A method and apparatus for real-time leveling control that involves identifying a contact force model to determine and apply specific force components along peripheral axes, using a force controller and position controller to adjust forces and positions based on feedback, and calibrating spring forces to ensure accurate planarization, with the apparatus comprising a force estimator and position controller to manage the contact force model and parallel condition between the superstrate and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional planarization techniques are used, then substrate topography can be addressed, but precise real-time leveling control between superstrate and substrate cannot be achieved
Solution Approach 1:
The patent implements a feedback control system where sensors detect the parallel condition between superstrate and substrate surfaces in real-time, and this information is fed back to actuators that adjust the superstrate position to maintain optimal contact force distribution. This closed-loop feedback mechanism enables precise real-time leveling control, directly resolving the contradiction between manufacturing precision and process reliability.
Solution Approach 2:
The system dynamically adjusts contact force parameters by controlling actuator positions and forces applied to the superstrate. By changing these physical parameters in real-time based on detected surface conditions, the system achieves both high precision leveling control and uniform planarization results, resolving the technical contradiction.
2Manufacturing precision
If contact force is increased to improve planarization, then surface leveling improves, but force distribution uniformity deteriorates
Solution Approach 1:
The patent applies different contact forces at different locations by independently controlling multiple actuators positioned around the periphery of the superstrate. Each actuator adjusts its force output based on local surface conditions detected by sensors, creating a non-uniform force distribution that achieves uniform planarization results. This local quality approach resolves the contradiction between surface leveling quality and force distribution uniformity.
Solution Approach 2:
The system dynamically adjusts contact forces in real-time during the planarization process, transitioning from static to dynamic force control. The actuators continuously modify their output forces based on feedback from surface sensors, enabling the system to maintain optimal force distribution across varying surface conditions, thereby resolving the contradiction between leveling quality and force uniformity.
3Manufacturing precision
If multiple actuators are used for force control, then leveling accuracy improves, but device complexity increases
Solution Approach 1:
The patent employs a control system where multiple actuators and sensors share common control logic and processing infrastructure. The same controller manages all actuators, and the same sensor data processing pipeline handles inputs from multiple sensors. This multi-functional approach allows the system to achieve high leveling accuracy with multiple actuators while minimizing the increase in overall device complexity through resource sharing and standardized control architecture.
Data Source
AI summary
A method of real time leveling control between a superstrate and a substrate is provided. A contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes is identified. A set point force required for performing the planarization is determined. Each force component is calculated based on the contact force model. The planarization is performed by applying each force component along a corresponding axis of the plurality of axes. The contact force model is identified based on a parallel condition between two contacting surfaces of a superstrate chuck for retaining the superstrate and a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.