Planarization Curing Layout Using Separate LED Exposure
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Solution Overview
Problem
Existing planarization techniques in semiconductor fabrication face challenges due to non-uniform UV light transmission through transparent superstrate chucks, leading to unsatisfactory curing performance and the need for complex, costly optical components.
Innovation Solution
A method and system that dispense formable material onto a substrate, form a multilayer structure with a superstrate, and cure it using an array of light-emitting diodes at a separate location, eliminating the need for additional optical components and ensuring uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV light radiation is transmitted through a transparent superstrate chuck, then curing of the formable material can be achieved, but non-uniform transmission of UV light radiation occurs leading to unsatisfactory curing performance
Solution Approach 1:
The patent extracts the curing function from the superstrate chuck by providing a separate curing station with UV light source. The superstrate chuck is no longer required to be transparent to UV light, as the curing occurs at a different location. This separates the holding function of the chuck from the curing function, allowing each to be optimized independently.
Solution Approach 2:
The patent introduces an intermediary curing station that mediates between the superstrate chuck and the substrate. The curing station receives the substrate with formable material, applies UV light for curing, and then returns the cured substrate. This intermediary system enables uniform curing without requiring modifications to the superstrate chuck.
2Reliability
If numerous optical components are used to direct UV light radiation through the superstrate chuck, then curing can be achieved, but the system becomes large, complex, and costly
Solution Approach 1:
The patent extracts the curing function from the superstrate chuck assembly, eliminating the need for complex optical components within the chuck. The curing station is provided as a separate, simplified system with direct UV light exposure, removing the need for dichroic mirrors, beam combiners, prisms, and other optical elements that would be required to direct light through a transparent chuck.
Solution Approach 2:
The patent replaces the complex optical system (mechanical arrangement of mirrors, lenses, and beam directors) with a simpler direct illumination system. The curing station provides UV light directly to the substrate without requiring mechanical optical components to redirect the light path, significantly simplifying the system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves uniform curing of the substrate without the drawbacks of non-uniform UV transmission and reduces system complexity and cost by eliminating the need for complex optical components, improving the planarization process in semiconductor fabrication.
Implementation Method 1
the curing station including an array of light-emitting diodes
Implementation Method 2
curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes
Data Source
AI summary
A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting, at a planarizing station at a first location, a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the superstrate from the superstrate chuck, moving the multilayer structure from the first location to a curing station located at a second location away from the first location, the curing station including an array of light-emitting diodes, and curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes.