Planarization Curing Layout for Uniform LED UV Exposure
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Solution Overview
Problem
Existing planarization techniques in semiconductor fabrication face issues with non-uniform UV light transmission due to the use of transparent superstrate chucks, leading to unsatisfactory curing performance and the need for complex, costly optical components in high-profile systems.
Innovation Solution
A method and system that dispense formable material onto a substrate, form a multilayer structure with a superstrate, and then cure it using an array of light-emitting diodes at a separate curing station, eliminating the need for additional optical components and ensuring uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV light radiation is transmitted through a transparent superstrate chuck, then the curing process can be performed, but non-uniform transmission of UV light radiation occurs leading to unsatisfactory curing performance
Solution Approach 1:
The system separates the superstrate chuck from the curing station, eliminating the chuck structure from the UV light path. The superstrate is released from the chuck before curing, allowing uniform UV light transmission without structural interference.
Solution Approach 2:
The superstrate is extracted from the chuck holder before the curing process. This removes the chuck structure that causes non-uniform UV light transmission, allowing the UV light to uniformly cure the formable material.
2Reliability
If numerous optical components are used to direct UV light radiation through a transparent superstrate chuck, then the curing process can be performed, but the system becomes large with high profile and significant cost
Solution Approach 1:
The patent removes the superstrate chuck from the curing path and uses direct UV light illumination from LEDs. This eliminates the need for complex optical components such as dichroic mirrors, beam combiners, prisms, and lenses that would otherwise be required to direct light through the chuck structure.
Solution Approach 2:
The patent replaces complex optical mechanical systems with a simpler LED-based illumination system. The array of LEDs directly illuminates the formable material without requiring mechanical optical components to redirect or focus the light.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides uniform curing performance without the complexity and cost of traditional systems, improving the planarization process and reducing system size, thereby enhancing manufacturing efficiency and throughput.
Implementation Method 1
the curing station including an array of light-emitting diodes
Implementation Method 2
curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes
Data Source
AI summary
A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting, at a planarizing station at a first location, a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the superstrate from the superstrate chuck, moving the multilayer structure from the first location to a curing station located at a second location away from the first location, the curing station including an array of light-emitting diodes, and curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes.