Planarized Coil Layer Direct Contact Magnetoresistance Sensor
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Solution Overview
Problem
Existing magnetic field sensing technologies face challenges in achieving optimal performance due to the presence of dielectric materials between coil layers and magnetoresistance elements, which can affect signal conductivity and magnetic field sensitivity.
Innovation Solution
A method is developed to fabricate a planarized coil layer in direct contact with a magnetoresistance element without any dielectric material, using chemical mechanical polishing to ensure a gapless interface, and a capping layer is deposited over the coil and MR element for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is placed between coil layer and magnetoresistance element, then electrical insulation is improved, but magnetic field sensitivity and signal conductivity deteriorate
Solution Approach 1:
The patent removes the dielectric material layer that traditionally separates the coil layer and magnetoresistance element. By extracting this insulating layer, the invention achieves direct contact between the coil and MR element, eliminating the dielectric barrier that would otherwise impede magnetic field coupling and signal conductivity, thus resolving the contradiction between electrical insulation and magnetic sensitivity.
Solution Approach 2:
The invention merges the coil layer and magnetoresistance element into direct contact, eliminating the intermediate dielectric layer. This merging allows the magnetic field generated by the coil to directly interact with the magnetoresistance element, improving magnetic field sensitivity and signal conductivity while maintaining electrical insulation through alternative design approaches.
2Manufacturing precision
If planarization is performed on coil layer, then manufacturing precision of interface is improved, but device complexity increases
Solution Approach 1:
The patent applies planarization processing to the coil layer before depositing the magnetoresistance element. This preliminary action ensures that the coil layer surface is sufficiently flat to accommodate direct contact with the MR element, achieving the necessary interface precision without requiring additional complex structures or processes later in fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the magnetic field sensor's sensitivity and conductivity by eliminating dielectric barriers, leading to improved performance and accuracy in magnetic field detection.
Implementation Method 1
a surface of a coil layer has been planarized using chemical mechanical polishing (CMP) so that the MR element may be directly attached to the planarized coil layer
Implementation Method 2
a magnetoresistance element, or a magnetotransistor
Implementation Method 3
forming a coil in a coil layer
Data Source
AI summary
In one aspect, a method includes forming a coil in a coil layer, performing planarization on the coil layer, and depositing a magnetoresistance (MR) element on the planarized coil layer. No dielectric material is between the planarized coil layer and the MR element. In another aspect, a magnetic field sensor includes a substrate, a planarized coil layer comprising a coil on the substrate, a magnetoresistance (MR) element in contact with the planarized coil layer, and a capping layer deposited over the MR element and the planarized coil layer. No dielectric material is between the planarized coil layer and the MR element.