3D Printing on PCBs with Planarized Adhesive Surfaces
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Solution Overview
Problem
Three-dimensional printing on uneven or gap-filled printed circuit boards results in warping, air bubbles, and poor adhesion of 3D printed materials due to uneven surfaces and slick components.
Innovation Solution
A method involving high temperature-high pressure fusion of substrates with through holes, polishing, and surface treatment to create an even, adhesive surface for 3D printing, using substrates like FR4 and copper, and embedding devices in pockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D printing is performed directly on the PCB surface, then the printing process is simple and fast, but the printed material warps or forms air bubbles due to uneven surfaces
Solution Approach 1:
The patent applies preliminary action by performing surface planarization and polishing processes before 3D printing to create a flat, even surface. This preparatory step eliminates surface irregularities that would cause warping or air bubbles during printing, ensuring proper adhesion while maintaining printing efficiency.
2Ease of manufacture
If 3D printing is performed on uneven surfaces, then no surface preparation is needed, but adhesion is poor due to air bubbles and warping
Solution Approach 1:
The patent implements preliminary surface preparation including planarization and polishing to create a flat, adhesive surface before printing. This ensures reliable adhesion of 3D printed material to the PCB substrate by eliminating air pockets and warping issues that would compromise bond strength.
Solution Approach 2:
The patent changes surface parameters through polishing and planarization processes, modifying surface roughness and flatness to optimal values for adhesion. This parameter optimization ensures that the PCB surface achieves the right balance between smoothness for adhesion and texture for material bonding.
3Device complexity
If multiple substrates are stacked without filling gaps, then assembly is simple, but gaps cause uneven surfaces that prevent secure adhesion
Solution Approach 1:
The patent extracts or removes gaps between stacked substrates by filling them with additional substrate material. This elimination of voids creates a uniform, flat surface across the entire assembly, enabling secure adhesion of 3D printed material while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable adhesion and consistent performance of 3D printed materials by eliminating gaps and unevenness, enhancing the reliability and consistency of the PCB assembly.
Implementation Method 1
The second substrate fuses to the first substrate using a high temperature-high pressure process
Implementation Method 2
The first surface, the first top surface, and the second top surface are adhesive due to a surface treatment
Data Source
AI summary
Systems, methods, and other embodiments described herein relate to a fabrication procedure to enable a 3D printing technique for a printed circuit board (PCB). In one embodiment, a circuit board assembly includes a first substrate, a second substrate, and a device. The first substrate includes a first surface and a second surface opposite the first surface. The first substrate has through holes. The second substrate is within the through holes. The second substrate is fused to the first substrate using a high temperature-high pressure process. The second substrate has a first top surface and a pocket. The device is positioned within the pocket. The device has a second top surface that is flush with the first surface and the first top surface. The device bonds to the second substrate. The first surface, the first top surface, and the second top surface are adhesive due to a surface treatment.