Planarized Temperature Sensor with Intermediary Insulation Layer

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Solution Overview

Problem

Existing thin temperature sensors face challenges in planarization due to protrusions of insulation films in contact with the thermosensitive body, limiting their ability to be uniformly flat.

Innovation Solution

A thin temperature sensor design featuring a holder with paired second layers and a first layer, where the first layer includes a housing space to house the thermosensitive portion and electric wires, and adhesive bodies made of polyvinyl chloride are used to secure the components, allowing for planarization without limiting the resin materials used.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two insulation films are used to cover the sensor element, then the sensor element is protected, but the package cannot be planarized due to protrusions

Engineering Contradiction:

Improveprotection of sensor elementVSAvoidplanarization of package

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

A third insulation film is introduced as an intermediary layer between the two original insulation films. This mediator film fills the protruding portions and enables planarization of the package surface while maintaining the protective function of the original insulation films.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The packaging structure is segmented into three distinct insulation film layers instead of two. This segmentation allows each layer to perform specific functions: the original two films provide protection while the added third film provides planarization, resolving the contradiction between protection and flatness.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If inner layer materials are melted by heating to form the holder, then the holder is created, but the resin materials are limited by melting point requirements

Engineering Contradiction:

Improveformation of holderVSAvoidchoice of resin materials

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The thermal field (heating process) used to form the holder is replaced with a mechanical field (compression molding). This substitution eliminates the need for melting and curing processes, allowing the use of thermoplastic resin materials that can be directly compressed and shaped without thermal processing constraints.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentEP4239299B1Temperature sensor and method for producing temperature sensor

Publication Date: 2025.06.11 SHIBAURA ELECTRONICS CO LTD

Figure 1A~1B
Figure 2A~2B
Figure 3A~3D

AI summary

Provided is a thin temperature sensor which can be planarized, without particularly limiting resin materials used for outer layers and an inner layer. A temperature sensor (1) according to the present invention includes: a sensor element (10) including a thermosensitive portion (11 and 13) and paired electric wires (15 and 17) electrically connected to the thermosensitive portion (11); and a holder (30) configured to hold the sensor element 10. The holder (30) includes a housing space (37) that includes a through hole opening on top and bottom surfaces, to house the thermosensitive portion (11 and 13) and the electric wires (15 and 17).