Planarizing Apparatus Gas Viscosity Reduction
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Solution Overview
Problem
Current planarization techniques, such as CMP and ink jet methods, face challenges in achieving flatness and filling performance on substrates, particularly with soft materials, and can result in non-filling defects due to gas incorporation during the curing process.
Innovation Solution
A planarizing apparatus that applies a curable composition to a substrate, reduces its viscosity with a condensable gas, and includes a deaeration unit to release the gas, ensuring improved filling performance and flatness by preventing gas incorporation during curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ink jet technique is used to eject droplets of curable composition, then the pattern of droplets can be adjusted to complement substrate irregularities, but gas from the environmental atmosphere is taken into the curable composition at the contact with the template, causing bubbles and non-filling defects
Solution Approach 1:
The patent applies an inert atmosphere (nitrogen or other inert gas) in the environment where the curable composition is applied and cured. This prevents gas from the environmental atmosphere from being taken into the curable composition during the curing process, thereby eliminating bubbles and non-filling defects while maintaining the beneficial droplet pattern adjustment capability
Solution Approach 2:
The patent performs preliminary deaeration of the curable composition before application and curing. By removing dissolved gas from the composition in advance through deaeration treatment, the formation of bubbles and non-filling defects is prevented during the subsequent curing process, allowing the ink jet technique to achieve its filling performance benefits
2Manufacturing precision
If CMP is used to planarize soft materials, then hard materials can be planarized effectively, but expensive strict process control is required and it causes dents in recessed portions
Solution Approach 1:
The patent replaces the mechanical CMP process with a chemical planarization approach using curable composition that fills recessed portions and cures to form a flat surface. This substitution eliminates the need for expensive strict process control and mechanical pressure application, while effectively planarizing both hard and soft materials without causing dents
Solution Approach 2:
The patent changes the fundamental mechanism from mechanical removal (CMP) to chemical filling and curing. By controlling the viscosity and curing properties of the curable composition rather than applying mechanical pressure, the process achieves flatness without the complexity of strict process control and without causing mechanical damage to recessed portions
3Manufacturing precision
If the curable composition is applied to fill substrate irregularities, then filling performance improves, but gas dissolution in the composition causes bubbles and non-filling defects during curing
Solution Approach 1:
The patent performs preliminary deaeration of the curable composition before application to the substrate. By removing dissolved gas in advance, the composition can fill substrate irregularities effectively without subsequently forming bubbles or exhibiting non-filling defects during the curing process
Solution Approach 2:
The patent maintains an inert atmosphere during the application and curing processes. This prevents external gas from dissolving into the curable composition, thereby eliminating the source of bubbles and non-filling defects while preserving the composition's ability to fill substrate irregularities effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces non-filling defects and achieves advanced planarization of uneven substrates by enhancing the spread and curing of the curable composition, maintaining flatness and improving filling performance.
Implementation Method 1
a first supply unit configured to supply a first gas that decreases viscosity of the curable composition to the curable composition
Implementation Method 2
a deaeration unit configured to release the first gas supplied by the first supply unit from the curable composition
Implementation Method 3
a curing unit configured to cure the curable composition
Data Source
AI summary
A molding apparatus includes a mechanism configured to apply a curable composition onto a substrate with irregularities, a pressing and releasing mechanism that presses or releases a mold (super straight) having a flat surface against the curable composition on the substrate, and a curing mechanism configured to cure the curable composition by light radiation, a first supply unit configured to supply a first gas to the curable-composition application mechanism, and a second supply unit configured to supply a second gas different from the first gas to the pressing and releasing mechanism.