Plant-Root Thermal Insulation Coating for Electronic Substrates
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Solution Overview
Problem
Existing thermal management materials for electronic devices are inefficient in dissipating heat, particularly at hotspots, and may pose environmental and safety risks due to their synthetic composition and thickness.
Innovation Solution
A thermal management material comprising a thermal conductive coat and a heat insulation coat, where the insulation coat is made from plant root powder and resin, applied to a substrate to manage and dissipate heat effectively, reducing overheating and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing thermal management materials are used, then heat dissipation is achieved, but they are inefficient at hotspots and pose environmental risks
Solution Approach 1:
The patent applies composite materials by combining plant root powder (natural insulator) with resin (binding agent) to create a heat insulation coat. This composite structure provides both thermal insulation properties and environmental friendliness, resolving the contradiction between heat dissipation efficiency and environmental risk by using naturally derived materials that are biodegradable and non-toxic.
Solution Approach 2:
The patent changes the material composition parameters by replacing synthetic thermal management materials with a combination of plant root powder and resin. This parameter change transforms the material properties to achieve both effective heat insulation and environmental compatibility, addressing the harmful factors associated with conventional synthetic materials.
2Temperature
If existing thermal management materials are used, then heat dissipation is achieved, but device lifetime is reduced due to overheating risks
Solution Approach 1:
The patent segments the thermal management system into two distinct functional layers: a thermal conductive coat applied directly to the substrate for heat conduction, and a heat insulation coat made of plant root powder and resin for thermal insulation. This segmentation allows each layer to optimize its specific function, improving overall heat management efficiency and thereby extending device lifetime by preventing overheating.
Solution Approach 2:
The combination of thermal conductive and heat insulation coats creates a composite thermal management system that enhances heat dissipation efficiency. The plant root powder and resin composite in the insulation coat provides superior thermal insulation properties, reducing heat buildup and extending device operational lifetime.
3Reliability
If existing thermal management materials are used, then thermal management is achieved, but fire and skin burn risks remain
Solution Approach 1:
The patent changes the material composition from synthetic to natural (plant root powder and resin), which fundamentally alters the safety parameters. Natural plant-based materials have inherent fire resistance and lower melting points compared to synthetic materials, reducing fire and skin burn risks while maintaining thermal management effectiveness.
Solution Approach 2:
The use of plant root powder, a natural and biodegradable material, replaces persistent synthetic materials. This natural material decomposes safely and does not contribute to long-term environmental hazards or retain heat in dangerous ways, thereby reducing fire and burn risks associated with conventional thermal management materials.
4Temperature
If existing thermal management materials are used, then heat dissipation is achieved, but environmental impact increases
Solution Approach 1:
The patent creates a composite material system using plant root powder and resin that is biodegradable and environmentally benign. This composite replaces synthetic materials that persist in the environment, thereby reducing environmental impact while maintaining heat dissipation efficiency through the synergistic combination of thermal conductive and insulating properties.
Solution Approach 2:
The patent converts the typically wasted plant root material into a beneficial thermal insulation component. By utilizing plant root powder that would otherwise be discarded, the invention creates an environmentally friendly thermal management solution that reduces waste and environmental impact while providing effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of thermal conductive and heat insulation coats with plant root powder and resin enhances heat dissipation, reduces device overheating, increases device lifetime, and minimizes fire and skin burn risks while being ecologically friendly and lightweight.
Implementation Method 1
a thermal conductive coat deposited on the substrate
Implementation Method 2
a heat insulation coat deposited on the thermal conductive coat
Data Source
AI summary
Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.