Plasma Processing Apparatus with Projecting Antenna Supporters
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Plasma processing apparatuses face challenges in achieving uniform plasma density distribution across large substrates, leading to inefficiencies and increased costs due to plasma diffusion towards inner walls and the need for frequent cleaning, which affects the quality and productivity of processes like silicon thin film deposition.
Innovation Solution
A plasma processing apparatus with a plasma generator supporter that projects into the vacuum chamber, allowing for a more even arrangement of plasma generators and reducing attachment area, combined with substrate holders for simultaneous processing of multiple substrates, enhancing plasma uniformity and reducing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single large spiral induction coil is used to cover large substrates, then the plasma production area increases, but the plasma density uniformity deteriorates due to increased difference between central and peripheral parts
Solution Approach 1:
The single large induction coil is divided into multiple smaller induction coils arranged in an array. Each coil generates plasma locally, and the combined effect covers the entire large substrate area. This segmentation ensures that each coil maintains reasonable dimensions to preserve plasma density uniformity while collectively achieving large-area coverage.
2Area of stationary object
If the size of the spiral coil is increased to cover larger substrates, then the plasma production area increases, but the plasma density uniformity worsens and standing waves may form in the antenna
Solution Approach 1:
The induction coil system is segmented into multiple independent smaller coils rather than using one large coil. This prevents standing wave formation in individual antennas while collectively covering the required large area. Each segment operates independently with controlled dimensions to maintain plasma density homogeneity.
3Manufacturing precision
If antennas are attached to the inner walls of the vacuum chamber, then plasma distribution can be controlled, but approximately one half of the generated plasma diffuses toward the inner walls without being used for the plasma process
Solution Approach 1:
Instead of attaching antennas only to the inner walls (two-dimensional surface mounting), the invention positions multiple induction coils in three-dimensional space above the substrate. This spatial arrangement directs plasma generation more effectively toward the substrate center, reducing radial diffusion to the walls and improving plasma usage efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves plasma usage efficiency, reduces cleaning frequency, and increases productivity by achieving higher uniformity and reducing resource consumption, enabling high-quality silicon thin film deposition on large substrates with reduced running costs.
Implementation Method 1
The plasma generator generates a plasma by ionizing gas molecules in the vacuum chamber
Implementation Method 2
a radio-frequency electric current is applied to a radio-frequency antenna (or induction coil) to generate an induction electric field inside the vacuum chamber. This induction electric field accelerate electrons, and then the electrons collide with the gas molecules, so that the gas molecules are ionized to generate a plasma
Data Source
AI summary
The present invention aims at providing a plasma processing apparatus for performing a plasma processing on a planar substrate body to be processed, the apparatus being capable of generating the plasma with good uniformity and efficiently using the plasma, and having a high productivity. That is, the plasma processing apparatus according to the present invention includes: a vacuum chamber; one or plural antenna supporters (plasma generator supporters) projecting into the internal space of the vacuum chamber; radio-frequency antennas (plasma generators) attached to each antenna supporter; and a pair of substrate body holders provided across the antenna supporter in the vacuum chamber, for holding a planar substrate body to be processed.