Plasma System Back End Pull Control for Load Lock Scheduling

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Solution Overview

Problem

The existing push methodology for plasma processing systems requires sharing proprietary back end intelligence and data capabilities with front end developers, leading to integration complexity, intellectual property concerns, and inefficient wafer loading and unloading due to untimely delivery, especially in multi-job environments with limited load locks.

Innovation Solution

Implementing a pull methodology where the back end acts as the master, scheduling specific wafer loading requests to the front end, optimizing load lock utilization without divulging back end intelligence, and allowing the front end to retain control while the back end interrupts for maintenance, enabling efficient and timely wafer processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the push methodology is used where the front end acts as master to push wafer information to the back end, then the customer can acquire and customize a commodity front end independently, but the back end intelligence and data capabilities must be shared with front end developers, leading to integration complexity and intellectual property concerns

Engineering Contradiction:
ImproveFront end customization and independent acquisitionVSAvoidIntegration complexity and IP protection
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The system is segmented into two independent modules: a customizable front end module and a proprietary back end module. The front end can be independently acquired and customized by customers, while the back end retains its intelligence and data capabilities as a separate entity. This segmentation allows customers to own their front end without needing to access or understand the back end's proprietary algorithms and data structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An intermediary communication interface is introduced between the front end and back end. This interface uses standardized protocols and data formats that allow the front end to push wafer information to the back end without requiring the front end developers to understand or access the back end's proprietary intelligence and data structures. The intermediary layer protects intellectual property while enabling functional integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the push methodology is used for wafer loading, then the front end can control the process, but untimely wafer delivery occurs in multi-job environments with limited load locks, reducing productivity

Engineering Contradiction:
ImproveFront end control over wafer loadingVSAvoidWafer processing efficiency
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The wafer loading control system is made dynamic by allowing the back end to interrupt the front end's push methodology when necessary. The back end can send interrupt signals to request urgent wafer loading based on real-time chamber readiness and job priorities. This dynamic control mechanism enables the system to adapt to changing conditions in multi-job environments, ensuring timely wafer delivery while maintaining front end operational control.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

A feedback mechanism is implemented where the back end continuously monitors chamber status, job priorities, and load lock availability, then provides feedback signals to the front end. When the back end detects that a chamber is ready and a high-priority job is waiting, it sends a feedback signal requesting urgent wafer loading. This feedback loop enables timely wafer delivery without requiring the front end to have complete knowledge of back end operations.

Inventive Principle:
Principle #23Feedback

3Productivity

If the back end acts as master in pull methodology to schedule wafer loading, then load lock utilization is optimized and productivity improves, but the front end must cede some control

Engineering Contradiction:
ImproveLoad lock utilization efficiencyVSAvoidFront end operational control
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The control paradigm is inverted from the traditional push methodology where the front end is master, to a pull methodology where the back end acts as master for scheduling wafer loading. The back end uses its intelligence and data capabilities to determine optimal loading times and priorities, then pulls wafer information from the front end accordingly. This inversion enables optimized load lock utilization while the front end retains the ability to push information when needed.

Inventive Principle:
Principle #13The other way round (Inversion)

4Loss of time

If proprietary back end intelligence and data capabilities are shared with front end developers to enable integration, then timely wafer loading can be achieved, but intellectual property is compromised

Engineering Contradiction:
ImproveWafer delivery timing efficiencyVSAvoidIntellectual property protection
Core Design Contradiction:
Loss of timeVSLoss of information

Solution Approach 1:

An intermediary communication layer is introduced that translates front end push requests and back end interrupt requests into standardized commands. This intermediary protects the back end's proprietary intelligence and data structures by not exposing them to the front end developers. The front end can achieve timely wafer loading by responding to standardized interrupt signals without needing to understand or access the back end's proprietary algorithms, data structures, or decision-making logic.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS8906163B2Methods and apparatus for integrating and controlling a plasma processing system
Publication Date: 2014.12.09 LAM RES CORP
  • US8906163B2 patent drawing
  • US8906163B2 patent drawing
  • US8906163B2 patent drawing

AI summary

A method of operating one or more back end circuits of a plasma processing system, comprising: prior to a front end module receiving one or more wafers to be processed, receiving preliminary data at a back end circuit, wherein the preliminary data indicates a recipe and a predetermined number, the predetermined number indicating a number of wafers to be processed; determining whether a plasma processing chamber is ready for processing; and if the chamber is ready for processing and via the back end circuit, selecting a load lock, based on the predetermined number, instructing the front end module to pull the one or more wafers into the load lock, enabling the chamber to process a first wafer of the one or more wafers according to the recipe, and subsequent to the processing of the first wafer, instructing the front end module to remove the first wafer from the chamber.