Plasma Block With Integrated Cooling Channels
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Solution Overview
Problem
Conventional remote plasma sources face challenges in achieving high power density due to extended lengths required for smooth plasma path formation, leading to inefficient heat transfer and reduced ionization efficiency.
Innovation Solution
The use of additive manufacturing to create plasma blocks with integrated cooling channels and reduced component segments, allowing for more complex flow paths and higher power density, along with a ferrite block and inductive coil configuration, enhances heat transfer and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional remote plasma sources use extended lengths to form smooth plasma paths, then path geometry is improved, but power density decreases
Solution Approach 1:
The plasma block is divided into multiple segments (first plasma block segment, second plasma block segment) that can be assembled together to form the complete plasma path. This segmentation allows the plasma path to be formed through compact 3D routing rather than extended linear paths, reducing overall length while maintaining smooth geometry.
Solution Approach 2:
The patent transitions from conventional linear plasma path design to three-dimensional plasma block segmentation with internal channels. By utilizing vertical stacking and multi-directional channel routing, the plasma path achieves smooth geometry in a compact volume, eliminating the need for extended lengths.
2Ease of manufacture
If conventional plasma blocks use simple cooling configurations, then manufacturing is easier, but heat transfer efficiency decreases
Solution Approach 1:
The cooling channels are integrated directly into the plasma block segments during additive manufacturing, merging the cooling function with the structural component. This eliminates separate cooling assemblies and thermal interfaces, improving heat transfer efficiency while simplifying manufacturing through single-process fabrication.
Solution Approach 2:
Additive manufacturing enables complex cooling channel geometries (including curved paths and varying cross-sections) that cannot be achieved with conventional machining. This parameter change in manufacturing capability allows optimized thermal pathways that follow heat flow patterns, significantly improving heat transfer efficiency.
3Shape
If multiple plasma block segments are assembled together, then complex flow paths are achieved, but thermal interfaces increase
Solution Approach 1:
The patent acknowledges that segmented construction creates thermal interfaces, but converts this potential harm into a benefit by designing the segmentation to enable additive manufacturing integration. The segments are configured so that cooling channels can be continuously formed across segment boundaries during printing, transforming the interface problem into an opportunity for integrated thermal management.
Solution Approach 2:
The patent introduces thermal interface materials or bonding mechanisms as intermediaries between plasma block segments. These intermediaries minimize thermal resistance at segment joints, allowing complex multi-segment configurations to maintain efficient heat transfer paths without significant thermal interface penalties.
4Adaptability or versatility
If additive manufacturing is used for plasma blocks, then integrated cooling channels are achieved, but manufacturing precision requirements increase
Solution Approach 1:
Dividing the plasma block into segments allows each segment to be manufactured and validated independently, reducing the cumulative precision requirements. The segmentation strategy enables modular quality control where each printed component can be inspected and adjusted before final assembly, lowering overall manufacturing precision barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in increased power density and improved heat transfer efficiency, reducing thermal interfaces and operational heat, thereby enhancing the plasma processing effectiveness.
Implementation Method 1
The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment
Implementation Method 2
The systems may include an inductive coil, and the inductive coil may extend about the ferrite block within the aperture through the remote plasma source
Data Source
AI summary
Exemplary semiconductor processing systems may include a remote plasma source. The remote plasma source may include a first plasma block segment defining an inlet to an internal channel of the first plasma block segment. The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment. The remote plasma source may include a second plasma block segment defining an outlet from an internal channel of the second plasma block segment. The second plasma block segment may also define a cooling channel between the internal channel of the second plasma block segment and a first exterior surface of the second plasma block segment. The systems may include a semiconductor processing chamber defining an inlet fluidly coupled with the outlet from the remote plasma source.