Plasma Box Cleaning Flow for Deposit Removal in Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in effectively removing deposits from the plasma box and processing container, leading to reduced apparatus efficiency and increased maintenance needs.
Innovation Solution
A substrate processing apparatus with a plasma box that generates plasma and includes two gas nozzles, one with negative pressure relative to the processing container, allowing for controlled introduction and flow of cleaning gases to efficiently remove deposits within the plasma box and processing container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning methods are used for the plasma box and processing container, then deposits can be removed to some extent, but the cleaning effectiveness is insufficient and maintenance frequency increases
Solution Approach 1:
The cleaning system is segmented into multiple independent gas nozzles (first gas nozzle in processing container, second gas nozzle in plasma box) that can be controlled separately. This allows targeted cleaning of different regions with optimized gas flow parameters, improving overall cleaning effectiveness while reducing the need for frequent comprehensive maintenance.
Solution Approach 2:
The system changes pressure parameters by creating negative pressure in the second gas nozzle relative to the processing container. This pressure differential drives cleaning gas flow more effectively through the plasma box, enhancing deposit removal capability and extending maintenance cycles between cleanings.
2Reliability
If gas flow rate is increased to improve cleaning effectiveness, then deposits are removed more efficiently, but gas consumption increases
Solution Approach 1:
Different gas flow rates and pressures are applied to different nozzles based on local cleaning needs. The second gas nozzle in the plasma box operates under negative pressure for targeted deposit removal, while the first gas nozzle in the processing container uses different parameters. This localized approach maintains effective cleaning while optimizing gas consumption in each region.
Solution Approach 2:
The system uses pneumatic pressure differentials (negative pressure in second gas nozzle) to drive gas flow and enhance cleaning effectiveness without requiring proportionally higher gas consumption. The pressure differential creates efficient gas flow paths that maximize cleaning power while minimizing overall gas usage.
3Reliability
If complex cleaning systems are implemented to improve cleaning effectiveness, then deposit removal is enhanced, but device complexity increases
Solution Approach 1:
The gas nozzles serve multiple functions: they introduce process gases during normal operation and serve as cleaning gas delivery systems during maintenance. The plasma box and processing container structure remains unchanged while enabling both processing and cleaning functions, avoiding the need for separate complex cleaning hardware.
Solution Approach 2:
The system uses its existing structural components (gas nozzles, plasma box, processing container) for self-cleaning without requiring external complex cleaning equipment. The negative pressure system and gas flow paths are integrated into the existing apparatus structure, allowing the system to clean itself using minimal additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes deposits from the plasma box and processing container, reducing particle generation and extending the maintenance cycle of the apparatus.
Implementation Method 1
a plasma box 31 including an interior, which communicates with an interior of the processing container 2, and configured such that plasma is generated in the interior of the plasma box 31
Implementation Method 2
a second gas nozzle 22 installed in the plasma box 31 and configured such that an interior of the second gas nozzle 22 is adjusted to have a negative pressure with respect to the interior of the processing container 2
Data Source
AI summary
A substrate processing apparatus includes: a processing container configured to be depressurized; a plasma box including an interior, which communicates with an interior of the processing container, and configured such that plasma is generated in the interior of the plasma box; a first gas nozzle installed in the processing container and into which a cleaning gas is introduced; and a second gas nozzle installed in the plasma box and configured such that an interior of the second gas nozzle is adjusted to have a negative pressure with respect to the interior of the processing container.