Detachable Plasma Chamber Antenna Gap Adjustment
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Solution Overview
Problem
Conventional plasma processing apparatuses of the RLSA type lack flexibility in adjusting antenna size and gap, necessitating separate apparatuses for different wafer sizes and process conditions, which increases costs and complicates maintenance.
Innovation Solution
A plasma processing apparatus with a detachable second housing between the first housing and the electromagnetic wave supply device, allowing for easy adjustment of antenna size and gap by replacing cylindrical members of varying heights and diameters, enabling the same apparatus to accommodate different wafer sizes and process conditions without requiring a new apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the container and antenna are fixedly combined to constitute the plasma processing apparatus, then the structural stability is improved, but the adaptability in adjusting antenna size and gap deteriorates
Solution Approach 1:
The plasma processing apparatus is divided into separable modules: the container (10) can be detached from the antenna (20), allowing independent selection and adjustment of each component based on processing requirements. This segmentation enables flexibility in configuring antenna size and gap distance while maintaining structural integrity during operation.
Solution Approach 2:
The apparatus transitions from a fixed configuration to a dynamic, adjustable system where the gap between the antenna and worktable can be modified by changing the container height or antenna position. This dynamic capability allows optimization of processing parameters for different wafer sizes and process conditions.
2Manufacturing precision
If different plasma processing apparatuses are prepared for different wafer diameters and process contents, then the manufacturing precision for specific processes is improved, but the device complexity and cost increase
Solution Approach 1:
A single plasma processing apparatus is designed to handle multiple wafer sizes (6-inch to 12-inch) and various process conditions through adjustable configuration. The universal design eliminates the need for separate dedicated apparatuses for different applications, reducing overall system complexity while maintaining process optimization capability.
Solution Approach 2:
The apparatus enables process optimization by allowing changes in key parameters such as antenna size, gap distance, and power settings. These parameter adjustments can be made by reconfiguring the detachable components, enabling the same apparatus to achieve manufacturing precision equivalent to dedicated apparatuses for different process conditions.
3Adaptability or versatility
If the antenna size and gap are adjusted to accommodate different wafer sizes and process conditions, then the adaptability is improved, but the ease of operation deteriorates due to complex adjustment requirements
Solution Approach 1:
By segmenting the apparatus into detachable modules (container and antenna), the adjustment process is simplified to straightforward assembly and disassembly operations. Operators can easily change configuration by replacing entire modules rather than making complex incremental adjustments, improving ease of operation while maintaining high adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances flexibility and reduces costs by allowing the same apparatus to handle various wafer sizes and process conditions, simplifying maintenance and facilitating upgrades, while minimizing the number of parts to replace due to renovation or failure.
Implementation Method 1
an antenna unit comprising a slot plate and a waveguide dielectric body to radiate microwaves
Implementation Method 2
supply electromagnetic waves into the process container... supply a plasma exciting gas into the process container
Data Source
AI summary
A plasma processing apparatus including an essentially cylindrical chamber, which is airtight and grounded. The antenna unit is disposed on top of the chamber. The chamber has a divisible structure formed of an essentially cylindrical housing and a cylindrical chamber wall connected to the housing from above and surrounding a process space. The chamber wall is detachable.