Plasma Processing Chamber Bake Purge After Component Replacement
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Solution Overview
Problem
The durability of components in plasma processing apparatuses is compromised due to impurities from replaced parts, leading to contamination and inefficiencies in substrate processing, with prolonged maintenance times and difficulty in removing impurities from fine grooves.
Innovation Solution
A method involving preheating and bake purge operations to remove impurities, including gradual temperature control of coolant, normal pressure, and purging processes to prepare the processing space for efficient plasma treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are replaced after a predetermined number of plasma treatment operations, then the reliability of the apparatus is improved, but the time required for maintenance increases and impurities are introduced into the processing space
Solution Approach 1:
The patent applies preliminary action by performing a preheating operation before the bake purge operation. The preheating operation gradually increases the temperature of the processing space to a predetermined temperature range (100-200°C) before introducing purging gas. This preliminary temperature increase prepares the processing space for more effective impurity removal during the bake purge operation, reducing the overall maintenance time while ensuring thorough cleaning.
Solution Approach 2:
The patent utilizes parameter changes by controlling the temperature of the processing space during maintenance operations. The temperature is adjusted to a specific range (100-200°C) during the bake purge operation to optimize impurity removal efficiency. This temperature parameter change enhances the effectiveness of the purging process, allowing for faster and more complete removal of impurities compared to room temperature purging, thus reducing maintenance time.
2Manufacturing precision
If a purging operation is performed to remove impurities from component surfaces, then the purity of the processing space is improved, but the maintenance time increases and impurities in fine grooves are difficult to remove
Solution Approach 1:
The patent applies parameter changes by controlling the temperature of the processing space to a predetermined range (100-200°C) during the bake purge operation. This temperature increase enhances the removal of impurities from component surfaces, including those in fine grooves, by increasing molecular motion and reducing adhesion forces. The temperature parameter change makes the purging process more effective and faster compared to room temperature operations.
Solution Approach 2:
The patent implements preliminary anti-action by performing a preheating operation before the bake purge operation. This preheating gradually increases the temperature to prevent thermal shock and prepares the processing space for effective impurity removal. By preparing the thermal environment in advance, the subsequent purging operation can proceed more efficiently, reducing overall maintenance time while achieving thorough cleaning.
3Productivity
If the temperature of the processing space is rapidly increased during maintenance, then the efficiency of impurity removal is improved, but the apparatus may become overloaded
Solution Approach 1:
The patent applies preliminary action by performing a preheating operation that gradually increases the temperature of the processing space before the bake purge operation. This gradual temperature increase prevents thermal shock and avoids overloading the apparatus's thermal management system. The preheating phase prepares the apparatus for the subsequent higher-temperature bake purge operation, ensuring safe and efficient impurity removal without causing overload conditions.
Solution Approach 2:
The patent implements periodic action by dividing the temperature increase into distinct phases: a preheating phase with gradual temperature increase, followed by a bake purge phase at a higher predetermined temperature range (100-200°C). This periodic approach allows the apparatus to adjust to temperature changes in controlled steps, preventing overload while maintaining high impurity removal efficiency during the bake purge phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances maintenance efficiency by swiftly removing impurities and preventing chamber overload, ensuring effective plasma treatment without contamination.
Implementation Method 1
a preheating operation in which the temperature adjusting unit increases a temperature of the processing space by increasing a temperature of coolant supplied to the process chamber
Implementation Method 2
a bake purge operation performed after the preheating operation and including removing impurities from the component
Implementation Method 3
forming a temperature of the processing space to be 100 to 200 degrees Celsius
Implementation Method 4
generates plasma in a processing space by applying microwaves
Implementation Method 5
generates plasma in a processing space by applying microwaves
Data Source
AI summary
A method of processing a substrate using an apparatus for processing a substrate, which generates plasma in a processing space by applying microwaves is provided, the method including a plasma treatment operation of processing a substrate using plasma; a replacing operation of performing the plasma treatment operation a predetermined number of times and replacing a component included in the apparatus; and a backup operation of backing up the apparatus after the replacing operation, wherein the backup operation includes a preheating operation in which the temperature adjusting unit increases a temperature of the processing space by increasing a temperature of coolant supplied to the process chamber; and a bake purge operation performed after the preheating operation and including removing impurities from the component.