Plasma Chamber Component Cleaning via Thermal Depolymerization
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Solution Overview
Problem
Existing methods for cleaning plasma processing apparatus components are inadequate for removing deposits that are not easily removed by plasma cleaning, particularly those formed on surfaces that plasma cleaning gases cannot reach.
Innovation Solution
A method involving the formation of a film on the components using a mixture of isocyanate and amine or hydroxyl-containing gases, followed by heating to depolymerize the film and remove the deposits during substrate treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plasma cleaning is used to remove deposits, then fluorocarbon films can be removed by active species, but deposits made of metal-containing materials or formed on surfaces that plasma gas cannot reach cannot be effectively removed
Solution Approach 1:
The invention changes the cleaning mechanism from plasma-based chemical etching to thermal depolymerization. By heating the component to a specific temperature range (200-400°C), the polymer film undergoes depolymerization and decomposes into volatile compounds that can be removed. This parameter change (from chemical to thermal process) enables effective cleaning of metal-containing deposits and deposits in hard-to-reach areas where plasma cannot penetrate.
Solution Approach 2:
The invention introduces a polymer film as an intermediary layer on the component surface. This film serves multiple functions: it acts as a protective coating during substrate treatment, provides a matrix for deposit accumulation that can be easily removed together, and enables thermal depolymerization cleaning. The intermediary film transforms the cleaning problem from directly removing stubborn deposits to removing a decomposable polymer matrix that carries the deposits away.
2Reliability
If plasma cleaning is performed frequently to remove deposits, then cleaning effectiveness is maintained, but component exchange frequency increases and productivity decreases
Solution Approach 1:
The invention applies preliminary action by forming a protective polymer film on the component surface before substrate treatment begins. This pre-formed film prevents direct contact between deposits and the component surface, reducing the adhesion strength of subsequent deposits. The preliminary protective layer makes later cleaning easier and less frequent, as deposits accumulate on the removable film rather than bonding directly to the component.
Solution Approach 2:
The polymer film acts as a disposable protective layer that is intentionally designed to be temporary. After accumulating deposits during substrate treatment, the entire film-with-deposits structure is removed through thermal depolymerization. This disposable film approach is more economical than frequently replacing entire components or performing complex plasma cleaning operations, as the film can be rapidly decomposed and removed in a simple heating step.
3Object-affected harmful factors
If a protective film is formed on component surfaces, then deposits are prevented from directly contacting the surface, but the film itself requires removal after use
Solution Approach 1:
The invention merges the protective film formation and deposit removal processes into a single integrated step. The polymer film is designed to undergo depolymerization at a specific temperature range, transforming the protective coating into a removable residue that carries accumulated deposits away from the component. This merging combines what would otherwise be separate operations (protective coating application and cleaning) into one thermal treatment step, reducing overall process complexity.
Solution Approach 2:
The invention utilizes phase transitions of the polymer film, specifically the transition from a stable polymeric state during protection to a decomposed volatile state during removal. By controlling the heating temperature to match the depolymerization point of the specific polymer used, the film naturally transitions from its protective function to its removal function. This phase transition approach eliminates the need for separate chemical cleaning agents or mechanical removal methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes deposits from components without damaging them, reducing the need for plasma cleaning and extending the component exchange frequency.
Implementation Method 1
heating the component so that depolymerization of the compound forming the film occurs
Implementation Method 2
a compound forming the film is generated by polymerization of a first compound contained in the first gas and a second compound contained in the second gas, the first compound being isocyanate and the second compound being amine or a compound having a hydroxyl group
Data Source
AI summary
There is disclosed a method for cleaning a component of a plasma processing apparatus, a surface of the component being included in a surface that defines an inner space formed in a chamber of the plasma processing apparatus. The cleaning method comprises: forming a film on the surface of the component by supplying a first gas and a second gas into the inner space, wherein a compound forming the film is generated by polymerization of a first compound contained in the first gas and a second compound contained in the second gas, the first compound being isocyanate and the second compound being amine or a compound having a hydroxyl group; and removing, after substrate treatment is performed in the inner space, a deposit formed on the film during the substrate treatment by heating the component so that depolymerization of the compound forming the film occurs.