Thin Film Ceramic Coating for Plasma Chamber Uniformity

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Solution Overview

Problem

In the semiconductor industry, plasma etch reactors face challenges with non-uniform plasma resistant coatings on plasma generation chamber components, leading to varying etch rates and intra-wafer uniformity issues due to high porosity, thickness variations, and surface roughness in traditional coatings.

Innovation Solution

A plasma generation chamber with a faceplate and selectivity modulation device (SMD) featuring a thin film plasma resistant ceramic coating applied via ion assisted deposition (IAD) or physical vapor deposition (PVD), with a thickness of less than 30 microns, porosity of less than 1%, and thickness non-uniformity of less than 4%, providing consistent plasma corrosion resistance and uniform etch rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional plasma resistant coatings are applied to plasma generation chamber components, then corrosion resistance is provided, but coating uniformity and surface roughness deteriorate

Engineering Contradiction:

Improveplasma corrosion resistanceVSAvoidcoating thickness uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies ion assisted deposition (IAD) or physical vapor deposition (PVD) processes to deposit ceramic coatings with controlled parameters achieving thickness uniformity better than 4% and porosity less than 1%, resolving the contradiction between corrosion resistance and coating uniformity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite ceramic coatings (such as yttria-stabilized zirconia, aluminum oxide, or silicon oxide) that combine plasma resistance with uniform deposition characteristics, achieving both corrosion protection and coating uniformity

Inventive Principle:

Principle #40Composite materials

2Reliability

If traditional plasma resistant coatings are applied to plasma generation chamber components, then corrosion resistance is provided, but surface roughness increases

Engineering Contradiction:

Improveplasma corrosion resistanceVSAvoidsurface roughness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The IAD/PVD deposition parameters are optimized to produce smooth surfaces with roughness less than 10 micro-inches by controlling deposition rate, ion energy, and substrate temperature, resolving the contradiction between corrosion resistance and surface smoothness

Inventive Principle:

Principle #35Parameter changes

3Reliability

If thick plasma resistant coatings are applied to maintain low porosity, then corrosion resistance improves, but coating thickness uniformity deteriorates

Engineering Contradiction:

Improveplasma corrosion resistanceVSAvoidcoating thickness non-uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent uses thin film coatings (5-30 microns) deposited via IAD/PVD that achieve low porosity (<1%) and high uniformity (<4% non-uniformity) simultaneously, resolving the contradiction between corrosion resistance through low porosity and thickness uniformity

Inventive Principle:

Principle #30Flexible shells and thin films

4Ease of manufacture

If non-uniform coatings are used on plasma generation chamber components, then manufacturing complexity is reduced, but etch rate consistency deteriorates

Engineering Contradiction:

Improvecoating application simplicityVSAvoidetch rate uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The IAD/PVD process parameters are precisely controlled to achieve thickness uniformity better than 4%, ensuring etch rate consistency across wafers while maintaining manufacturability through a standardized deposition process

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high process stability and consistency between plasma generation chambers, with etch rates varying by less than 5% and intra-wafer uniformity of 95%-97%, meeting tightened customer specifications.

Implementation Method 1

The plasma resistant ceramic coating may be formed on the article using ion assisted deposition (IAD) or physical vapor deposition (PVD)

Methodology Applied

Scientific EffectIon assisted deposition: Ion Beam

Implementation Method 2

The plasma resistant ceramic coating may be formed on the article using ion assisted deposition (IAD) or physical vapor deposition (PVD)

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 3

The plasma generation chamber is to generate plasma for a processing chamber by accelerating radicals from the faceplate toward the SMD and through a plurality of holes in the SMD

Methodology Applied

Scientific EffectPlasma: Plasma

Data Source

PatentUS9460898B2Plasma generation chamber with smooth plasma resistant coating

Publication Date: 2016.10.04 APPLIED MATERIALS INC

AI summary

A faceplate or a selectivity modulation device (SMD) for a plasma generation chamber has a plasma resistant ceramic coating on a surface of the faceplate or SMD, wherein the plasma resistant ceramic coating comprises a thickness of less than approximately 30 microns, a porosity of less than 1% and a thickness non-uniformity of less than 4%.