Plasma Chamber Conductive Coating for Stable Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Plasma processing in chambers leads to damage of inner walls due to ion and radical collisions, and existing protective films can hinder electron exchange between plasma and electrodes, causing process instability.
Innovation Solution
A method involving coating the chamber's inner surfaces with a conductive film formed from a gas mixture containing carbon and hydrogen, which enhances electron exchange and protects the components from plasma damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a protective film is formed on the inner wall of the chamber, then damage to the inner wall from ion and radical collisions is reduced, but electron exchange between plasma and electrodes is hindered, causing process instability
Solution Approach 1:
The invention changes the electrical conductivity parameter of the protective film by selecting specific materials (tungsten, molybdenum, nickel, cobalt, or their alloys) that inherently possess conductive properties. This allows the film to simultaneously protect against plasma damage while maintaining electron exchange between plasma and electrodes, thus ensuring process stability without requiring additional structural modifications.
2Loss of substance
If the protective film is made thicker to prevent ion penetration, then component consumption is reduced, but electron exchange between plasma and electrodes may be further hindered
Solution Approach 1:
The invention changes the material composition parameter of the protective film to use conductive materials, which allows the film to maintain protective function at optimal thickness without excessive buildup. The conductive nature of these materials ensures that even at sufficient thickness to block ions, the film does not impede electron exchange, thus resolving the contradiction between component protection and plasma-electrode interaction.
Solution Approach 2:
The invention employs composite material strategies by using pure conductive metals (tungsten, molybdenum, nickel, cobalt) or their alloys as protective films. These materials combine protective properties against plasma erosion with inherent electrical conductivity, creating a composite functionality that simultaneously addresses both ion blocking and electron exchange requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the plasma processing by preventing component consumption and maintaining desired process conditions, while ensuring the protective film is thick enough to prevent ion penetration.
Implementation Method 1
coating surfaces of components inside a chamber with a film having conductive properties by turning a first gas containing carbon and hydrogen into plasma inside the chamber
Implementation Method 2
processing the substrate by turning a second gas into plasma inside the chamber
Data Source
AI summary
A method of processing a substrate with plasma includes: coating surfaces of components inside a chamber with a film having conductive properties by turning a first gas containing carbon and hydrogen into plasma inside the chamber; loading the substrate into the chamber; and processing the substrate by turning a second gas into plasma inside the chamber in a state where the surfaces of the components inside the chamber are coated with the film having conductive properties.