Substrate Plasma Chamber Fluid Injection for Uniform Field Distribution
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Solution Overview
Problem
Existing plasma apparatuses suffer from asymmetric plasma field distribution, leading to non-uniform etching or deposition processes during semiconductor and display device manufacturing.
Innovation Solution
A substrate processing apparatus and method that control the positions and proportions of conductive and non-conductive fluid injection using pumps and valves to adjust the plasma field distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plasma apparatus uses conventional RF power supply to generate plasma field, then the plasma field is formed, but the plasma field distribution becomes asymmetric leading to non-uniform etching or deposition
Solution Approach 1:
The patent introduces a conductive fluid as an intermediary substance injected into the plasma chamber to modify and control the plasma field distribution. The conductive fluid acts as a mediator between the RF power supply and the plasma, enabling adjustment of plasma density and uniformity across the substrate surface without changing the fundamental RF generation mechanism
Solution Approach 2:
The patent changes the physical and chemical parameters of the plasma environment by injecting conductive fluid at controlled positions and proportions. By varying the injection parameters (position, flow rate, composition), the plasma field distribution can be adjusted to achieve uniform plasma across the substrate, directly addressing the uniformity issue
2Productivity
If the plasma field is asymmetrically distributed, then the plasma process proceeds, but the etching or deposition becomes non-uniform across the substrate
Solution Approach 1:
The patent applies local quality by injecting conductive fluid at specific localized positions within the plasma chamber rather than uniformly throughout. This targeted injection creates localized modifications to the plasma field in asymmetric regions, balancing the overall plasma distribution across different areas of the substrate to achieve uniform processing
3Adaptability or versatility
If conductive fluid is injected to control plasma field, then plasma field distribution becomes adjustable, but the system complexity increases with pumps and valves
Solution Approach 1:
The conductive fluid injection system serves multiple functions: it controls plasma field distribution, adjusts plasma density, and compensates for asymmetric field patterns. This multi-functionality reduces the need for separate systems for each function, thereby limiting the increase in overall system complexity while achieving high adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the formation of a freely adjustable plasma field, ensuring uniform plasma processes and minimizing component damage by compensating for asymmetry.
Implementation Method 1
when radio frequency (RF) power is supplied, a gas inside a chamber may be affected by an electromagnetic field to form a plasma field
Implementation Method 2
a gas inside a chamber may be affected by an electromagnetic field to form a plasma field
Data Source
AI summary
A substrate processing apparatus is provided. The substrate processing apparatus includes a chamber comprising a support, the support configured to have mounted thereon a substrate; at least one channel disposed in the chamber and into which a conductive fluid or a non-conductive fluid is configured to be injected; and a control unit. The control unit includes a first pump and a second pump configured to respectively supply the conductive fluid and the non-conductive fluid to the at least one channel; and a first valve configured to receive the conductive fluid and the non-conductive fluid from the first pump and the second pump, respectively, and control proportions at which the conductive fluid and the non-conductive fluid are injected into the at least one channel.