Plasma Chamber OES Feedback for Real-Time Coil Uniformity Control
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Solution Overview
Problem
There is a challenge in achieving uniformity in plasma processes on semiconductor substrates as feature dimensions shrink, leading to increased difficulties in maintaining process uniformity across different substrates and substrate portions.
Innovation Solution
A plasma processing system with optical emission spectroscopy (OES) systems and actuators that adjust the position and tilt of coils in real-time based on OES measurements to enhance plasma uniformity, applicable to inductively coupled plasma processes and potentially other plasma processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional plasma processing systems are used, then the basic plasma process can be performed, but the spatial uniformity of the plasma deteriorates as feature dimensions shrink
Solution Approach 1:
The coil assembly is made dynamically adjustable through actuators that can change its position and orientation in real-time during the plasma process. This dynamic capability allows the system to adapt to different feature dimensions and maintain spatial uniformity across shrinking features, resolving the contradiction between manufacturing precision and adaptability.
Solution Approach 2:
Optical emission spectroscopy (OES) systems provide real-time feedback on plasma characteristics, which is used by the controller to adjust the coil assembly position and orientation. This closed-loop feedback mechanism enables the system to maintain optimal spatial uniformity despite changes in feature dimensions, addressing both precision and adaptability requirements.
2Manufacturing precision
If the coil position is fixed, then the system structure is simple, but the plasma spatial uniformity deteriorates
Solution Approach 1:
The coil assembly is transformed from a fixed structure to a dynamically adjustable one using actuators. This allows the system to achieve improved spatial uniformity through real-time position and orientation changes, accepting the necessary increase in device complexity as a trade-off for manufacturing precision.
Solution Approach 2:
The patent replaces complex mechanical adjustment mechanisms with a more streamlined actuator system that can be controlled through electrical signals. This substitution reduces mechanical complexity while still enabling the coil assembly to achieve optimal positions for maintaining plasma spatial uniformity.
3Manufacturing precision
If real-time adjustments are made during plasma generation, then plasma uniformity is improved, but the process complexity increases
Solution Approach 1:
OES systems continuously monitor plasma characteristics and provide real-time feedback to the controller. This feedback loop enables automatic adjustments to the coil assembly position and orientation during plasma generation, improving plasma uniformity while managing control complexity through automated closed-loop control.
Solution Approach 2:
The system performs self-adjustment through automated feedback control, where the OES measurements directly inform the coil assembly adjustments without requiring external intervention. This self-service capability improves plasma uniformity while reducing the operational complexity for users.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved spatial uniformity of the plasma, leading to enhanced product uniformity and consistency by adjusting the plasma generation based on real-time feedback, which can be applied to various plasma processes beyond inductively coupled plasma.
Implementation Method 1
providing RF power to a coil disposed over the substrate support to generate a plasma of the one or more gases provided to the processing volume
Implementation Method 2
performing optical emission spectroscopy (OES) measurements of two or more locations of the processing volume during the generation of the plasma using one or more OES systems
Data Source
AI summary
A plasma processing system is provided including a processing chamber, one or more optical emission spectroscopy (OES) systems, and a controller. The processing chamber includes a chamber body enclosing a processing volume. The chamber body includes one or more windows. The processing chamber further includes a substrate support in the processing volume, a coil positioned over the substrate support, and one or more actuators configured to move the coil. Each OES system is optically coupled to one of the one or more windows and each OES system having an optical component configured to perform OES measurements on a portion of the processing volume. The controller is configured to adjust a position of the one or more actuators to move the coil based on the OES measurements.