Plasma Processing Chamber Layout to Limit Particle Adhesion
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Solution Overview
Problem
Existing plasma processing technologies face challenges in preventing particles generated during plasma sputtering from adhering to substrates, as well as in efficiently supplying plasma gases to ensure uniform film deposition and minimizing gas nozzle vibration and deactivation.
Innovation Solution
A plasma processing apparatus with gas nozzles positioned outside the plasma generation space to supply plasma generation gases, which reversely diffuse into the plasma generation space, reducing direct gas flow to substrates and minimizing particle adhesion, while allowing for increased nozzle diameter and multiple nozzle installation to reduce vibration and deactivation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If gas nozzles are positioned inside the plasma generation space to supply plasma gases, then plasma generation efficiency is improved, but particle adhesion to substrates increases
Solution Approach 1:
The gas nozzles are extracted from the plasma generation space and repositioned outside it. The nozzle outlets are positioned at the outer peripheral side of the plasma generation space, separating the gas supply mechanism from the plasma generation region. This extraction eliminates the direct flow path from nozzles to substrates, preventing particle adhesion while maintaining plasma generation efficiency through reverse diffusion of plasma gases.
2Reliability
If gas nozzle diameter is increased to reduce vibration, then gas supply stability is improved, but space requirements and device complexity increase
Solution Approach 1:
The gas supply function is segmented into multiple nozzles arranged in a circular pattern around the plasma generation space. Instead of using a single large-diameter nozzle, multiple smaller nozzles are distributed circumferentially. This segmentation achieves vibration reduction through balanced gas flow distribution while maintaining compact device geometry and simplifying the overall nozzle arrangement structure.
3Reliability
If multiple gas nozzles are installed to reduce deactivation, then plasma species reactivity is improved, but device complexity increases
Solution Approach 1:
The circular array of gas nozzles serves multiple functions simultaneously: (1) supplying plasma generation gases uniformly around the plasma space, (2) reducing deactivation effects through distributed gas injection, (3) maintaining compact device footprint, and (4) enabling flexible control of plasma characteristics. This multi-functional design achieves enhanced plasma species reactivity without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses particle adhesion to substrates, enhances film uniformity and quality, and maintains the reactivity of plasma species, leading to improved film deposition processes.
Implementation Method 1
a plasma partition wall airtightly provided on an outer wall of the processing container and configured to cover the opening and define a plasma generation space
Implementation Method 2
a processing gas supplier provided outside the plasma generation space and configured to supply a plasma generation gas
Implementation Method 3
a plasma electrode provided along the plasma partition wall
Data Source
AI summary
A plasma processing apparatus includes: a processing container having a vertical tubular shape and an opening formed in a side wall of the processing container, the processing container configured to accommodate a plurality of substrates in multiple stages; a plasma partition wall airtightly provided on an outer wall of the processing container and configured to cover the opening and define a plasma generation space; a plasma electrode provided along the plasma partition wall; and a processing gas supplier provided outside the plasma generation space and configured to supply a plasma generation gas.