Plasma Chamber Positioning Jig for RF Coil Realignment
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Solution Overview
Problem
In semiconductor processing, positional shifts of the RF coil in pre-clean chambers during physical vapor deposition can lead to non-uniform etching, causing errors and defects in semiconductor fabrication due to vibrations from substrate transfer and maintenance operations.
Innovation Solution
The use of jigs or fixtures attached to the chamber to record and reposition the RF coil to its original position, ensuring uniform film thickness and accurate etching by attaching to pre-existing holes in the chamber and utilizing screws or gauges to adjust and fine-tune the coil's position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate transfer and maintenance operations are performed, then productivity is improved, but the RF coil position shifts causing manufacturing precision to deteriorate
Solution Approach 1:
The patent applies preliminary action by recording the RF coil position before substrate transfer and maintenance operations, then using the recorded position to guide repositioning after operations complete. This ensures the coil returns to its original precise location despite the productivity-enhancing operations that caused displacement.
Solution Approach 2:
The patent implements feedback by measuring the RF coil position, comparing it to the recorded reference position, and using this information to drive the repositioning process. The feedback loop continues until the coil is accurately restored to its original position, maintaining manufacturing precision while allowing productivity operations to proceed.
2Manufacturing precision
If the RF coil position is frequently adjusted, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent introduces an intermediary positioning mechanism that simplifies the adjustment process. Rather than requiring complex manual repositioning procedures, the intermediary device provides a straightforward method to restore the RF coil to its recorded position, reducing the overall system complexity while maintaining etching uniformity.
3Ease of operation
If the RF coil position drifts, then ease of operation is improved (allowing flexible operations), but manufacturing precision deteriorates due to non-uniform etching
Solution Approach 1:
The patent applies preliminary anti-action by recording the RF coil position before operations begin, creating a reference that prevents the harmful effects of position drift. This recorded position serves as a guide to counteract any drift that occurs during flexible operations, ensuring manufacturing precision is maintained despite operational flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise repositioning of the RF coil, reducing fabrication errors and ensuring uniform etching of semiconductor substrates, thereby improving the accuracy and reliability of semiconductor processing operations.
Implementation Method 1
a radio frequency (RF) coil disposed within the resonator housing, an RF power source connected to the chamber for applying RF power to the RF coil
Implementation Method 2
Physical vapor deposition (PVD), or sputtering, is a process used in the fabrication of electronic devices. PVD is a plasma process performed in a vacuum chamber where a negatively biased target is exposed to a plasma of an inert gas
Implementation Method 3
Bombardment of the target by ions of the inert gas results in ejection of atoms of the target material. The ejected atoms accumulate as a deposited film on a substrate
Data Source
AI summary
A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.