Plasma Chamber Shielding Unit for Electromagnetic Field Focusing

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Solution Overview

Problem

In semiconductor device manufacturing, the inefficiency in substrate treatment using plasma etching arises from the electromagnetic field not being focused on the substrate, leading to reduced treatment efficiency.

Innovation Solution

A substrate treating apparatus is designed with a shielding unit and baffle system to confine the electromagnetic field within the chamber, ensuring it is focused on the substrate, enhancing plasma generation and treatment efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electromagnetic field is supplied into the chamber without focusing, then plasma can be generated in the chamber, but the electromagnetic field is not focused on the substrate leading to reduced treatment efficiency

Engineering Contradiction:
Improvesubstrate treatment efficiencyVSAvoidelectromagnetic field dispersion
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent extracts and removes the shielding unit from the chamber structure to selectively block and confine the electromagnetic field. The shielding unit is positioned to prevent EMF from dispersing outside the chamber while allowing it to concentrate on the substrate region, thus resolving the contradiction between plasma generation and field focusing.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The shielding unit acts as an intermediary element between the electromagnetic field source and the chamber environment. It mediates the EMF distribution by blocking field lines that would otherwise escape outside the chamber, thereby concentrating the energy on the substrate without preventing plasma generation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If electromagnetic field is allowed to extend outside the chamber, then plasma generation is not restricted, but efficiency in substrate treatment is reduced

Engineering Contradiction:
Improvesubstrate treatment efficiencyVSAvoidelectromagnetic field concentration on substrate
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The shielding unit is introduced as a separate component that extracts and blocks the portion of electromagnetic field extending outside the chamber. This prevents field dispersion while maintaining plasma generation capability, thereby increasing field concentration on the substrate.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The shielding unit creates a localized modification in the electromagnetic field distribution. By positioning shields at specific locations around the chamber, the EMF is confined to the substrate region, creating a non-uniform field distribution that concentrates energy where needed while allowing plasma generation elsewhere.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively focuses the electromagnetic field on the substrate, improving the efficiency of plasma-based substrate treatment processes by preventing field loss to the sides and outside of the chamber, thereby enhancing the etching process.

Implementation Method 1

a plasma source generating plasma from the gas supplied into the chamber

Methodology Applied
Scientific EffectPlasma generation: Plasma

Implementation Method 2

an electromagnetic field is formed in an inner space of a chamber and a process gas supplied into the chamber is excited to a plasma state

Methodology Applied
Scientific EffectElectromagnetic field excitation: Electromagnetic Induction

Implementation Method 3

a shielding unit preventing an electromagnetic field from an inside of the chamber to an outside of the chamber

Methodology Applied
Scientific EffectElectromagnetic field shielding: Faraday Cage

Implementation Method 4

a baffle disposed to surround the support member in the chamber and having through holes to exhaust a gas in the treating space

Methodology Applied
Scientific EffectGas flow through perforations:

Implementation Method 5

The etching is performed by ion particles included in plasma colliding with the substrate

Methodology Applied
Scientific EffectIon bombardment: Ion Beam

Data Source

PatentUS10777387B2Apparatus for treating substrate
Publication Date: 2020.09.15 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US10777387B2 patent drawing
  • US10777387B2 patent drawing
  • US10777387B2 patent drawing

AI summary

The present invention disclosed herein relates to a substrate treating apparatus, and more particularly, to an apparatus for treating a substrate using plasma. Embodiments of the present invention provide substrate treating apparatuses including a chamber having a treating space defined therein, a support member disposed in the chamber to support a substrate, a gas supply unit supplying a gas into the chamber, a plasma source generating plasma from the gas supplied into the chamber, a baffle disposed to surround the support member in the chamber and having through holes to exhaust a gas in the treating space, and a shielding unit preventing an electromagnetic field from an inside of the chamber to an outside of the chamber.