Plasma Chamber Cleaning Pressure Control to Protect Inner Films
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Solution Overview
Problem
Plasma cleaning in plasma processing apparatuses causes significant damage to the protective film on the inner surface of the processing container, leading to increased maintenance frequency and reduced productivity.
Innovation Solution
A method that specifies the pressure within the processing container based on the amount of damage to the protective film and the cleaning rate, adjusting the pressure to an optimal range to minimize damage while maintaining effective cleaning, using microwaves to generate plasma for cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma cleaning is performed by alternating between first pressure and second pressure higher than the first pressure, then cleaning effectiveness is improved, but damage to the protective film increases
Solution Approach 1:
The invention changes the pressure parameter from alternating between two pressures to maintaining a substantially constant pressure during plasma cleaning. This parameter change resolves the contradiction by eliminating the pressure cycles that cause protective film damage while maintaining cleaning effectiveness through continuous plasma generation at the optimized constant pressure level.
Solution Approach 2:
The invention eliminates the periodic alternation between different pressure levels that was previously used to enhance cleaning. By removing this periodic action and maintaining a steady pressure, the method prevents the repeated stress cycles on the protective film while still achieving effective cleaning through continuous plasma exposure.
2Productivity
If plasma cleaning is performed with high power to increase cleaning rate, then productivity is improved, but damage to the protective film increases
Solution Approach 1:
The invention optimizes the pressure parameter to a specific constant value that enables effective cleaning at reduced plasma power levels. This parameter change allows the system to achieve high cleaning rates without the need for high power that would otherwise damage the protective film, thus resolving the contradiction between productivity and film damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses damage to the processing container's interior, reducing maintenance frequency and enhancing productivity by minimizing protective film erosion and maintaining efficient deposit removal.
Implementation Method 1
plasma is generated in the processing container by microwaves
Data Source
AI summary
In a specification step, the pressure within a processing container at the time of plasma cleaning is specified from the amount of damage to a protective film that is provided on an inner surface of the processing container and the cleaning rate at which accumulated matter that accumulates in the processing container is removed, said amount of damage and said cleaning rate being treated as plasma cleaning parameters. In a cleaning step, the pressure within the processing container is adjusted to the pressure that was specified in the specification step, while a cleaning gas is supplied into the processing container, and microwaves are used to generate plasma within the processing container and plasma cleaning is performed within the processing container.