Plasma Coating Cross-Linking for Electronic Waterproofing
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Solution Overview
Problem
Conventional waterproof coatings for electronic devices face challenges such as inadequate thickness leading to local corrosion, high preparation costs, and poor heat dissipation, while existing plasma chemical vapor deposition methods struggle to achieve optimal water resistance and electric breakdown resistance.
Innovation Solution
A method involving plasma chemical vapor deposition using a mixture of monofunctional unsaturated fluorocarbon resin and polyfunctional unsaturated hydrocarbon derivatives, with a mass percent of 30-50% polyfunctional derivatives, to form a cross-linking structure that enhances the coating's network density and resistance to underwater electrification and electric breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Parylene coating is applied to achieve moisture resistance and corrosion resistance, then the protective function is improved, but the preparation cost increases and the preparation conditions become stricter
Solution Approach 1:
The patent changes the preparation conditions from high vacuum and high temperature to atmospheric pressure and room temperature by using plasma polymerization technology, making the process easier to implement while maintaining protective functions
Solution Approach 2:
The patent replaces the mechanical vacuum deposition system with a plasma chemical vapor deposition system, eliminating the need for high vacuum conditions and high temperature heating, thereby simplifying the preparation process
2Reliability
If the coating thickness is increased to prevent local corrosion, then the protective function is improved, but the heat dissipation performance deteriorates and signal blocking increases
Solution Approach 1:
The patent changes the deposition mode from thermal condensation to plasma polymerization, enabling high-quality coating formation at lower thickness with improved protective performance without compromising heat dissipation
Solution Approach 2:
The patent uses composite monomer systems (fluorocarbon resin with crosslinking agents) to create coatings with enhanced protective properties at optimized thickness, balancing corrosion protection and heat dissipation
3Strength
If thermal curing coating is used to form protective layer, then the coating strength is improved, but the temperature sensitive devices are damaged
Solution Approach 1:
The patent replaces thermal curing with plasma polymerization, using plasma energy instead of thermal energy to initiate and complete the coating formation process at room temperature, protecting temperature-sensitive devices
Solution Approach 2:
The patent introduces plasma as an intermediary energy form that enables coating crosslinking and strength development without direct thermal exposure to the substrate and its components
4Ease of manufacture
If liquid phase coating method is used for conformal coating, then the coating process is simplified, but solvent damage to circuit board occurs
Solution Approach 1:
The patent replaces liquid phase coating with vapor phase plasma polymerization, eliminating solvent exposure entirely while maintaining conformal coating capabilities and process simplicity
Solution Approach 2:
The patent uses plasma environment as an inert medium for coating deposition, avoiding all solvent-related harmful effects while enabling effective conformal coating of circuit boards
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly increases the coating's resistance to underwater electrification and electric breakdown, improving hydrophobicity and corrosion resistance, extending the service life of electronic devices in solvent and corrosive environments by 30-55%.
Implementation Method 1
Plasma chemical vapor deposition (PCVD) is a technology to generate a solid film by activating reactive gas by plasma and promoting chemical reaction on the matrix surface or near surface space
Implementation Method 2
introducing other monomer components with polyfunctional group cross-linking structure. When plasma undergoes glow discharge, an active group with relatively high energy in the monomer components is broken to form active patches, and additional active patches being introduced are cross-linked in the plasma environment to form a network structure
Implementation Method 3
improving hydrophobicity and corrosion resistance
Data Source
AI summary
A preparation method of a waterproof and electric breakdown-resistant coating, which belongs to the technical field of plasma chemical vapor deposition. In the method, a base material is placed in a reaction chamber, the reaction chamber is vacuumed continuously, and inert gas or nitrogen is fed; monomer steam is fed, plasma discharge is started, and a waterproof and electric breakdown-resistant coating is prepared on the surface of the base material, wherein the component of the monomer steam is a mixture of at least one monofunctional unsaturated fluorocarbon resin and at least one polyfunctional unsaturated hydrocarbon derivative, and the mass percent of the polyfunctional unsaturated hydrocarbon derivative in the monomer steam is 30-50%. The present invention introduces additional cross-linking patches to form a cross-linking structure by introducing other monomer components with polyfunctional group cross-linking structure; active groups with relatively high energy in the monomer components are broken to form active patches; and additional active patches being introduced are cross-linked in the plasma environment to form a dense network structure. The hydrophobicity of a film is guaranteed, and the corrosion resistance and underwater electrification resistance of electronic products are effectively improved.