Plasma-Resistant Multilayer Coating for Pinhole Surface Stability

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Solution Overview

Problem

Existing methods for forming plasma-resistant coatings on semiconductor equipment components fail to effectively address surface defects and instability due to pinholes, leading to mechanical and chemical degradation.

Innovation Solution

A method involving primary and secondary surface treatments, including ion beam treatment, to form a multilayer coating film that covers and flattens pinholes, using materials like Al2O3, ZrO2, or SiC, with specific process conditions to enhance adhesion and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a coating layer is deposited on a base material with pinholes, then plasma resistance is improved, but surface defects and peeling occur due to pinhole instability

Engineering Contradiction:
Improveplasma resistanceVSAvoidsurface stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary surface treatments (primary and secondary) before depositing the plasma-resistant coating layer. These treatments pre-flatten the surface and fill pinholes, creating a stable foundation that prevents subsequent peeling and maintains surface integrity during plasma exposure

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The coating process is divided into multiple sequential stages: primary surface treatment, preliminary coating deposition, secondary surface treatment, and final coating deposition. This segmentation allows each stage to address specific issues, with surface treatments handling pinholes and coating layers providing plasma resistance

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If multiple coating layers are deposited to cover pinholes, then surface defects are reduced, but process complexity increases

Engineering Contradiction:
Improvesurface defect controlVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Surface treatment processes act as intermediary steps between the base material and the coating layers. These intermediary treatments modify the surface topology to eliminate pinholes before coating deposition, simplifying the overall process by preventing defects rather than requiring multiple corrective coating layers

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If ion beam treatment is used to flatten the coating surface, then adhesion and stability are improved, but process time and energy consumption increase

Engineering Contradiction:
Improveadhesion strengthVSAvoidprocess time
Core Design Contradiction:
StrengthVSLoss of time

Solution Approach 1:

The ion beam treatment process uses optimized parameters (acceleration voltage, current density, treatment duration) to achieve effective surface flattening and adhesion improvement within reasonable timeframes. By carefully controlling these parameters, the process balances quality improvement with production efficiency

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multilayer coating film exhibits improved mechanical stability and chemical resistance, reducing surface defects and peeling, as demonstrated by reduced erosion in acidic environments.

Implementation Method 1

performing a secondary surface treatment on the preliminary primary coating layer to form a primary coating layer, wherein the secondary surface treatment is an ion beam treatment process, and an upper surface of the primary coating layer is flattened by the secondary surface treatment

Methodology Applied
Scientific EffectIon beam: Ion Beam

Implementation Method 2

depositing a preliminary primary coating layer covering the pinhole, on the surface of the base material

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS20260028710A1Method of manufacturing plasma-resistant multilayer coating film
Publication Date: 2026.01.29 SAMSUNG ELECTRONICS CO LTD
  • US20260028710A1 patent drawing
  • US20260028710A1 patent drawing
  • US20260028710A1 patent drawing

AI summary

Provided is a method of manufacturing a plasma-resistant multilayer coating film, the method including performing a primary surface treatment on a surface of a base material having a pinhole, in which a base material includes at least one material selected from ceramic, metal, semiconductor, or glass, depositing a preliminary primary coating layer covering the pinhole, on the surface of the base material, performing a secondary surface treatment on the preliminary primary coating layer to form a primary coating layer, and depositing a secondary coating layer on the primary coating layer, in which the secondary surface treatment is an ion beam treatment process, and an upper surface of the primary coating layer is flattened by the secondary surface treatment.