Plasma Polymerization Coating Apparatus with Rotation Racks
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Solution Overview
Problem
Conventional plasma polymerization coating technologies face limitations such as small batch size, low efficiency, high cost, and poor batch uniformity due to the fixed positions of substrates within rectangular vacuum chambers, leading to varying coating thicknesses across substrates.
Innovation Solution
A plasma polymerization coating apparatus with a central axis symmetrical vacuum chamber, rotation racks, and a secondary rotation mechanism that ensures substrates are uniformly exposed to reactive species, using a radial gas transport and discharge mechanism to maintain consistent reactive species density and a multilayer metal grid to control plasma flow, allowing for larger batch sizes and improved uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are positioned in fixed locations within a conventional rectangular vacuum chamber, then the coating process can be performed, but the coating thickness varies across different substrates resulting in poor batch uniformity
Solution Approach 1:
The patent implements a dual rotation mechanism where the rotation rack rotates substrates around a central axis, and a secondary rotation mechanism tilts substrates to maintain consistent orientation toward the plasma source. This dynamic positioning ensures uniform coating thickness across all substrates in the batch by continuously adjusting their positions during the coating process.
Solution Approach 2:
The patent creates equipotential conditions by designing the rotation and tilting mechanisms to maintain equal exposure conditions for all substrates to the plasma reactive species. All substrates experience the same plasma flux density regardless of their initial positions, achieving uniform coating across the batch.
2Productivity
If the vacuum chamber volume is increased to accommodate larger batch sizes, then productivity improves, but coating uniformity deteriorates due to varying distances from the plasma source
Solution Approach 1:
The dual rotation mechanism allows substrates at different radial distances from the central axis to maintain optimal orientation toward the plasma source. By dynamically adjusting substrate angles and positions, the system compensates for varying distances, enabling large batch sizes while maintaining uniform coating thickness across all substrates.
Solution Approach 2:
The patent applies local quality by tailoring the orientation and position of each substrate individually through the tilting mechanism. Each substrate is locally adjusted to face the plasma source at the optimal angle, ensuring uniform coating quality regardless of its position within the large-volume chamber.
3Productivity
If conventional plasma coating equipment is used, then the coating process can be performed, but treatment efficiency remains low due to small batch sizes and long processing times
Solution Approach 1:
The patent segments the substrate batch into multiple positions on the rotation rack, allowing simultaneous treatment of numerous substrates. The modular rotation rack design enables efficient utilization of chamber space, increasing batch size and overall treatment efficiency without compromising coating quality.
Solution Approach 2:
The continuous rotation and tilting mechanisms ensure that all substrates are continuously exposed to plasma reactive species throughout the coating process. This continuous action eliminates idle time and maximizes treatment efficiency by maintaining optimal coating conditions for all substrates simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves significant improvements in batch uniformity, increasing the vacuum chamber volume by 5-6 times, enhancing treatment efficiency, and reducing coating thickness variations by more than 70%, while maintaining the quality of the polymer coating.
Implementation Method 1
The gaseous organic monomer is turned into a plasma state by discharging electrical power to the monomer to produce various types of reactive species. Next, additional reactions between the reactive species and the monomer, or between the reactive species themselves, take place and form a polymer film on the substrate's surface.
Implementation Method 2
The gaseous organic monomer is turned into a plasma state by discharging electrical power to the monomer
Implementation Method 3
The atmosphere in the vacuum chamber is evacuated by a vacuum pump
Data Source
AI summary
Introduced here is a plasma polymerization apparatus. Example embodiments include a reaction chamber in a shape substantially symmetrical to a central axis. Some examples further include a rotation rack in the reaction chamber. The rotation rack may be operable to rotate relative to the reaction chamber about the central axis of the reaction chamber. Examples may further include reactive species discharge mechanisms positioned around a perimeter of the reaction chamber and configured to disperse reactive species into the reaction chamber in a substantially symmetrical manner from the outer perimeter of the reaction chamber toward the central axis of the reaction chamber, such that the reactive species form a polymeric coating on surfaces of the one or more substrates during said dispersion of the reactive species, and a collecting tube positioned along the central axis of the reaction chamber and having an air pressure lower than the reaction chamber.