Plasma Polymer Coating Layout for Uniform Deposition
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Solution Overview
Problem
Conventional coating apparatuses using PECVD processes often result in excessive decomposition of coating forming materials due to excessive exposure to plasma, leading to adverse effects on deposition velocity and uniformity of polymer coatings.
Innovation Solution
A coating apparatus and method where the substrate is positioned between a monomer discharge source and a plasma generation source, allowing only a portion of the coating forming material to pass through the plasma generation source, thereby reducing excessive decomposition and enhancing the quality of the polymer coating by controlling the reactions between reactive precursor species and the monomer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coating forming material is exposed to the plasma generation source for excitation, then the reactive precursor species are generated, but excessive exposure causes excessive decomposition of the coating forming material
Solution Approach 1:
The substrate is positioned between the monomer discharge source and plasma generation source, allowing only a portion of the coating forming material to pass through the plasma generation source. This partial exposure generates sufficient reactive precursor species while preventing excessive decomposition of the coating forming material.
2Productivity
If the coating forming material is excessively decomposed in the plasma generation source, then the deposition velocity and uniformity of polymer coating are adversely affected
Solution Approach 1:
By positioning the substrate between the monomer discharge source and plasma generation source, only a controlled portion of the coating forming material undergoes plasma excitation. This partial action maintains adequate deposition velocity while ensuring uniform coating quality by preventing excessive decomposition.
Solution Approach 2:
The coating forming material experiences different treatment in different regions: partial plasma excitation in the region between the discharge source and substrate, and no plasma exposure in other regions. This local differentiation of treatment ensures optimal deposition conditions and uniform coating quality.
3Reliability
If the substrate is placed between opposite electrodes of the plasma generation source for coating formation, then the coating forming material can be excited, but damage to the substrate may occur
Solution Approach 1:
The substrate is extracted from the direct path between the opposite electrodes of the plasma generation source. Instead, it is positioned between the monomer discharge source and plasma generation source, removing it from the harmful plasma environment while still allowing controlled coating formation through partial plasma exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material waste, improves the uniformity and quality of the polymer coating, and maintains the chemical integrity of the coating, while also simplifying the apparatus structure for easier operation and maintenance.
Implementation Method 1
a plasma generation source for applying an electrical power to the coating forming material so as to excite the coating forming material
Implementation Method 2
A typical coating apparatus implementing a PECVD (Plasma Enhanced Chemical Vapor Deposition) process
Implementation Method 3
the gaseous coating forming material, which may comprise, but is not limited to, an organic material, an organosilicon material, an inorganic material, and a combination thereof, is a gaseous monomer or monomer vapor
Data Source
AI summary
A coating apparatus includes a chamber body having a reaction chamber, a supporting rack, a monomer discharge source and a plasma generation source. The supporting rack has a supporting area for supporting the substrate. The monomer discharge source has a discharge inlet for introducing a coating forming material into the reaction chamber. The plasma generation source is arranged for exciting the coating forming material, wherein the supporting area of the supporting rack is located at a position between the monomer discharge source and the plasma generation source, so that the coating is evenly formed on the surface of the substrate, and the deposition velocity is increased.