Distributed Plasma Coil Array With RF Direct Drive Uniformity Control
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Solution Overview
Problem
Commercial substrate processing systems face challenges in achieving process uniformity due to the large size and high cost of traditional RF generators and matching networks, which limits the ability to individually control and fine-tune plasma characteristics, especially in applications with small gaps between electrodes or inductive coils.
Innovation Solution
The use of an array of RF direct drive circuits to supply power to inductive coils or electrodes, reducing the overall size and cost of RF generators and allowing for improved control of plasma characteristics by packaging them near the loads using integrated circuits and printed circuit boards, eliminating the need for discrete component matching networks and high impedance transmission lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional RF generators and matching networks are used, then plasma generation is achieved, but the system size and cost increase, limiting individual control capability
Solution Approach 1:
The patent divides the traditional single RF generator and matching network into multiple independent RF direct-drive circuits, each controlling a specific inductive coil or electrode. This segmentation enables individual control of plasma characteristics in different chamber regions while reducing the overall system footprint by eliminating centralized matching networks and high-impedance transmission lines.
2Ease of manufacture
If traditional RF generators are used, then plasma is generated, but packaging size and cost increase
Solution Approach 1:
The patent extracts and eliminates the bulky matching networks and high-impedance transmission lines from the RF power delivery system. By using low-impedance direct-drive circuits with integrated impedance matching, the system achieves RF power delivery capability while significantly reducing packaging size and manufacturing cost.
3Reliability
If inductive coils are used for plasma generation, then plasma is created, but process non-uniformity occurs due to varying magnetic field distribution
Solution Approach 1:
The patent implements RF direct-drive circuits that can independently control the power and phase to each inductive coil or electrode. This local control capability allows compensation for varying magnetic field distribution and achieves uniform plasma characteristics across different chamber regions, addressing the process non-uniformity issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reduced packaging size and cost, allowing for improved control of plasma uniformity and fine-tuning of plasma characteristics in substrate processing systems, particularly in applications with small gaps, enhancing processing efficiency and precision.
Implementation Method 1
The inductive coils generate a magnetic field that varies at different locations within the processing chamber, which leads to process non-uniformity
Implementation Method 2
The delivered RF energy ignites the process gases flowing inside the processing chamber to create plasma
Implementation Method 3
The electrodes generate an electric field that varies at different locations within the processing chamber, which leads to process non-uniformity
Data Source
AI summary
A substrate processing system includes a processing chamber including a window. A substrate support is arranged inside the processing chamber to support a substrate during plasma processing. A first array including E inductive coils arranged adjacent to and outside of the processing chamber, where E is an integer greater than three. A second array includes D RF direct drive circuits configured to output RF power to the first array, where D is an integer greater than three, and to generate plasma inside of the processing chamber.