Plasma Deposition Coil Assembly for Edge Thickness Uniformity
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Solution Overview
Problem
Existing plasma deposition processes, such as magnetron sputter, are susceptible to external magnetic field interference, leading to non-uniform thickness distribution on semiconductor substrates, particularly at the edge regions, due to the reliance on a single magnetic field orientation.
Innovation Solution
A plasma process apparatus with a coil assembly comprising inclined side coils generating magnetic field vectors in both vertical and horizontal directions, synchronized with a rotatable permanent magnet, to control plasma distribution and enhance process uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If magnetron sputter uses a single vertical magnetic field orientation, then plasma can be focused on the target, but thickness distribution uniformity deteriorates, especially at edge regions
Solution Approach 1:
The magnetic field generation system is segmented into multiple independent coil assemblies (first, second, and third side coils) positioned at different locations around the chamber. Each coil can generate magnetic field vectors independently, allowing the system to create complex multi-directional magnetic field patterns that improve plasma distribution and thickness uniformity across the substrate surface.
Solution Approach 2:
The invention transitions from a single vertical magnetic field dimension to multi-dimensional magnetic field vectors by inclining the side coils at predetermined angles. This enables generation of magnetic field vectors with both vertical and horizontal components, creating three-dimensional magnetic field distribution that guides plasma more effectively across the entire substrate including edge regions.
2Manufacturing precision
If the magnetic field is generated using a vertically oriented coil, then plasma focusing is achieved, but control over edge region thickness is lost
Solution Approach 1:
The coil assembly is designed with adjustable inclination angles and can be positioned at different locations around the chamber. The ability to adjust the orientation and position of the coils provides dynamic control over the magnetic field vector directions, enabling flexible adjustment of plasma distribution patterns to achieve uniform thickness control across the substrate including edge regions.
Solution Approach 2:
The invention changes the parameters of the magnetic field generation system by inclining the side coils at predetermined angles rather than positioning them vertically. This parameter change transforms the magnetic field vectors to have both vertical and horizontal components, enabling control over plasma distribution in multiple directions and improving edge region thickness control.
3Adaptability or versatility
If a fixed target magnet configuration is used, then device simplicity is maintained, but process variation control is reduced
Solution Approach 1:
The coil assembly serves multiple functions: it generates magnetic field vectors for plasma focusing, controls plasma distribution across the substrate, and enables adjustment of process parameters to adapt to different deposition requirements. This multi-functional design provides versatility in process variation control while the modular coil structure maintains reasonable device simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved plasma control and uniform thickness distribution on semiconductor substrates by guiding plasma in multiple directions, ensuring precise deposition across the substrate surface, including edge regions.
Implementation Method 1
at least one permanent magnet on the target, the at least one permanent magnet being rotatable and configured to distribute the plasma on the target through a magnetic field
Implementation Method 2
a coil assembly on an outer wall of the chamber, the coil assembly including a first side coil, a second side coil, and a third side coil that are inclined at a predetermined angle with respect to a horizontal direction, the first side coil, the second side coil, and the third side coil being configured to generate a first vector, a second vector, and a third vector, respectively, and the coil assembly being configured to generate a magnetic field vector guiding the plasma through a combination of the first vector, the second vector, and the third vector
Implementation Method 3
a plasma generator configured to generate plasma from the gas that is supplied by the gas supplier
Implementation Method 4
the plasma generator configured to deposit the deposition particles on the substrate through the plasma
Data Source
AI summary
Provided a plasma process apparatus including a chamber including a plasma processing space, a substrate stage included in the chamber, the substrate stage including a seating surface, a target including deposition particles to be deposited on the substrate, a gas supplier configured to supply gas into the chamber, a plasma generator configured to generate plasma from the gas, the plasma generator configured to deposit the deposition particles on the substrate through the plasma, at least one permanent magnet on the target being rotatable and configured to distribute the plasma on the target through a magnetic field, and a coil assembly on an outer wall of the chamber and assembly including first through third side coils inclined and being configured to generate first through third vectors, respectively, and the coil assembly being configured to generate a magnetic field vector guiding the plasma through a combination of the first through third vectors.