Plasma-Deposited Conductive Interconnects for Aircraft Lightning Protection

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Solution Overview

Problem

Aircraft constructed with composite materials face inefficiencies in dissipating electrical energy from lightning strikes, leading to potential damage due to inadequate conductive properties of polymeric materials, and conventional embedding techniques can cause surface deformities.

Innovation Solution

The implementation of a conductive layer with an interconnect using plasma-deposited metal to create an ohmic connection between expanded metal foil sections, bridging electrical disconnect regions and ensuring effective electromagnetic energy strike protection while maintaining a smooth surface profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional embedding techniques are used to embed metallic components into composite structures, then lightning strike protection is provided, but surface deformities occur

Engineering Contradiction:
Improvelightning strike protectionVSAvoidsurface smoothness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces conventional mechanical embedding techniques with plasma deposition technology. Instead of physically embedding metallic components into composite structures (which causes surface deformities), the invention uses plasma-deposited conductive layers to achieve electrical connectivity. This substitution of mechanical embedding with a deposition process eliminates surface irregularities while maintaining lightning strike protection functionality.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs composite structures combining conductive layers (expanded metal foil sections) with polymeric composite materials. The conductive layer is integrated into the composite structure through plasma deposition, creating a hybrid material system that provides both structural integrity and electrical conductivity for lightning strike protection without compromising surface smoothness.

Inventive Principle:
Principle #40Composite materials

2Reliability

If wire meshes are used on the surface of aircraft skin, then electrical energy conduction is improved, but surface smoothness deteriorates

Engineering Contradiction:
Improveelectrical energy conductionVSAvoidsurface smoothness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical wire mesh structures with plasma-deposited conductive layers. Instead of attaching wire meshes that create surface irregularities, the invention uses plasma deposition to create a conformal conductive layer that follows the surface contour, maintaining smoothness while providing electrical connectivity for energy dissipation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses thin conductive layers (expanded metal foil sections) deposited via plasma technology. These thin films conform to the surface geometry, providing electrical conductivity without the bulk and surface disruption associated with wire meshes. The thin film structure maintains surface smoothness while enabling effective lightning strike protection.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If graphite cloth and aluminum ply layers are used, then electrical conductivity is improved, but surface deformities and structural inconsistencies occur

Engineering Contradiction:
Improveelectrical conductivityVSAvoidsurface uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical layering of graphite cloth and aluminum ply with plasma deposition technology. The plasma deposition process creates a uniform, conformal conductive layer without the misalignments, gaps, and surface irregularities inherent in manual layering techniques. This substitution ensures both electrical conductivity and surface uniformity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the deposition parameters through plasma technology to achieve optimal conductive layer formation. By controlling plasma deposition parameters (temperature, pressure, deposition rate), the invention achieves uniform thickness and consistent electrical properties across the surface, eliminating the variability and structural inconsistencies associated with conventional layering methods.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the dissipation of electromagnetic energy and reduces structural inconsistencies, providing robust protection against lightning strikes while maintaining a smooth surface, thus ensuring the integrity and safety of aircraft components.

Implementation Method 1

The interconnect comprises a metal deposited using plasma deposition

Methodology Applied
Scientific EffectPlasma deposition: Physical Vapour Deposition

Implementation Method 2

The interconnect includes a conductive material that creates an ohmic connection between the adjacent conductive sheets of the conductive layer to bridge the gap in the electrical disconnect region

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP2781452B1Electromagnetic energy surface protection
Publication Date: 2018.12.19 THE BOEING CO
  • EP2781452B1 patent drawingFigure 1
  • EP2781452B1 patent drawingFigure 2A
  • EP2781452B1 patent drawingFigure 2B

AI summary

An electromagnetic energy protection system for an aircraft component, the system including a plurality of conductive sheets (208A, 208B, 208C, 208D, 208E) ohmically connected by conductive interconnects (210A, 210B). The conductive interconnects are metal formed by a metal deposition process. The metal deposition process can include a plasma deposition process. The conductive interconnects prevent the formation of surface deformities such as bumps that may be caused when connecting, either physically or electrically, adjacent conductive sheets.