Plasma Source Cooling Through Faraday Shield Slits
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Solution Overview
Problem
Plasma sources in semiconductor fabrication suffer from overheating, leading to material degradation and potential failure due to the use of high-power induction coils and Faraday shields, which impede effective cooling fluid application to dielectric tubes.
Innovation Solution
A plasma source cooling system that uses a manifold with nozzles to inject cooling fluid through slits in the Faraday shield directly to the dielectric tube, ensuring efficient heat removal and stabilization of the dielectric tube temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a Faraday shield is used between the induction coil and dielectric tube, then electromagnetic shielding is improved, but cooling fluid application is impeded
Solution Approach 1:
The Faraday shield is segmented into multiple sections with cooling fluid passages integrated between them, allowing cooling fluid to reach the dielectric tube through the shield structure itself rather than being blocked by it
Solution Approach 2:
Cooling fluid passages act as intermediaries that transfer cooling fluid through the Faraday shield structure, enabling thermal management while maintaining electromagnetic shielding functionality
2Power
If high-power induction coils are used, then plasma generation capability is improved, but heat generation increases
Solution Approach 1:
Cooling fluid is applied to the dielectric tube before excessive heat accumulation occurs, preventing thermal damage through continuous pre-cooling rather than reactive cooling
Solution Approach 2:
A hydraulic cooling system using fluid circulation through passages in the Faraday shield and dielectric tube provides active heat removal to manage thermal loads from high-power operation
3Temperature
If cooling fluid is applied to the dielectric tube, then temperature stabilization is improved, but system complexity increases
Solution Approach 1:
The cooling system merges the Faraday shield structure with cooling fluid passages, combining electromagnetic shielding and thermal management functions into a single integrated component rather than separate systems
Solution Approach 2:
The Faraday shield serves multiple functions simultaneously: electromagnetic shielding, structural support, and thermal management through integrated cooling passages, reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces the likelihood of system failure by quickly cooling the dielectric tube and stabilizing its temperature, preventing cracking and breach.
Implementation Method 1
an induction coil about a dielectric tube
Implementation Method 2
supply cooling fluid onto a surface of the dielectric tube through one of the Faraday shield slits
Data Source
AI summary
Cooling systems and methods for plasma sources used in semiconductor fabrication are provided. In one example, the plasma source includes an induction coil about a dielectric tube. The plasma processing apparatus further includes a Faraday shield located between the induction coil and the dielectric tube. The Faraday shield includes a plurality of Faraday shield slits. The plasma processing apparatus further includes a plasma source cooling system including a manifold. The manifold includes a plurality of nozzles, each nozzle configured to supply cooling fluid onto a surface of the dielectric tube through one of the Faraday shield slits of the plurality of Faraday shield slits.