Plasma Treatment Cover Positioning for Adhesive Removal
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Solution Overview
Problem
The existing plasma treatment methods for manufacturing electronic components face issues such as substrate carrier damage, decreased etching rate, and contamination due to adhesive material accumulation, which affect productivity and yield, especially when using resin sheets for holding substrates.
Innovation Solution
A plasma treatment method where a substrate held by a substrate carrier is placed on a stage with a cover that adjusts its distance to cover the frame without contacting the carrier, allowing plasma treatment while preventing exposure to the carrier, and an additional step to remove adhered substances by generating plasma at a greater distance, enhancing etching efficiency and reducing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric cover is disposed over the stage to protect the frame and holding sheet from plasma, then the substrate carrier damage is prevented, but adhesive material accumulates on the cover and causes contamination
Solution Approach 1:
The patent applies preliminary action by performing adhesive removal plasma treatment before the actual substrate processing. The cover is positioned at a first position during adhesive removal to expose its rear surface to plasma, preventing adhesive accumulation before it interferes with the manufacturing process
Solution Approach 2:
The patent implements dynamics by making the cover position adjustable between at least two positions. The cover can be moved to a first position for adhesive removal and a second position for substrate processing, allowing the system to adapt to different operational requirements and prevent adhesive accumulation dynamically
2Productivity
If the cover is positioned close to the frame and holding sheet during plasma treatment, then productivity is improved by preventing adhesive accumulation, but the substrate carrier may be damaged by plasma exposure
Solution Approach 1:
The patent uses a movable cover that can dynamically adjust its position between a first position close to the frame for preventing adhesive accumulation and a second position that protects the frame during substrate processing. This dynamic positioning allows the system to optimize for either productivity or protection depending on the process stage
Solution Approach 2:
The patent segments the plasma treatment process into distinct stages: adhesive removal stage where the cover is at the first position, and substrate processing stage where the cover moves to the second position. This segmentation allows each stage to be optimized independently for its specific purpose
3Productivity
If plasma treatment is continuously performed on multiple substrates, then productivity increases, but adhesive materials accumulate on the stage and contaminate subsequent substrates
Solution Approach 1:
The patent applies preliminary action by incorporating adhesive removal treatment before processing each new substrate. The cover is positioned at the first position to expose its rear surface to plasma, removing adhesive residues that would otherwise contaminate the stage and affect subsequent etching quality
Solution Approach 2:
The patent maintains continuity of useful action by integrating adhesive removal into the continuous processing flow. The cover position is adjusted automatically between processing cycles, allowing adhesive removal to occur without interrupting the overall production rhythm and maintaining consistent etching quality across multiple substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and productivity of electronic components by maintaining a high and stable etching rate, preventing substrate carrier damage, and reducing contamination from adhesive materials, allowing continuous processing without stopping for adhesive removal.
Implementation Method 1
a plasma treatment method in which a substrate held by a substrate carrier including a holding sheet and a frame disposed on an outer peripheral portion of the holding sheet is placed on a stage provided in the inside of a reaction chamber, and a plasma treatment is performed on the substrate
Implementation Method 2
an etching step using plasma of fluorine-based gas such as SF6
Implementation Method 3
The electrostatic adsorption mechanism includes an electrode for electrostatic adsorption (electrostatic chunk) (hereinafter, referred to as an ESC electrode) disposed in the inside of the stage. When a voltage is applied to the ESC electrode, Coulomb force is generated in a space between the ESC electrode and the substrate carrier
Implementation Method 4
a protective film deposition step using plasma of fluorocarbon gas such as perfluorocyclobutane (CFO are alternately repeated
Data Source
AI summary
Provided is a plasma treatment method including: placing a substrate carrier holding a substrate on a stage; adjusting a distance between a cover and the stage to a first distance in which the cover covers a frame without coming into contact with the substrate carrier; performing a plasma treatment on the substrate placed on the stage after the adjusting of the distance; carrying the substrate together with the substrate carrier out from a reaction chamber after the performing of the plasma treatment; and removing an adhered substance adhered to the cover by generating plasma in the inside of the reaction chamber after the carrying of the substrate, in which the distance between the cover and the stage in the removing of the adhered substance is a second distance greater than the first distance.